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Localized Liquation and Resultant Pitting Corrosion Behavior of Welding Coarse-Grained Heat-Affected Zone in Niobium-Stabilized Austenitic Stainless Steel 期刊论文
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2018, 卷号: 165, 期号: 11, 页码: C722-C731
作者:  Bai, GS;  Li, YY;  Lu, SP
收藏  |  浏览/下载:21/0  |  提交时间:2018/12/25
Microporous corrosion behavior of gold-plated printed circuit boards in an atmospheric environment with high salinity 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 11, 页码: 8877-8885
作者:  Li, Xiaogang;  Xiong, Ruilin;  Hu, Yuting;  Wu, Junsheng;  Dong, Chaofang
收藏  |  浏览/下载:130/0  |  提交时间:2018/12/04
Microporous corrosion behavior of gold-plated printed circuit boards in an atmospheric environment with high salinity 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 11, 页码: 8877-8885
作者:  Li, Xiaogang;  Xiong, Ruilin;  Hu, Yuting;  Wu, Junsheng;  Dong, Chaofang
收藏  |  浏览/下载:133/0  |  提交时间:2018/12/04
One derivate of Thiadiazole( MTYDBH) as Corrosion Inhibitors for Copper in 3.5% NaCl Solution Under Various Conditions 期刊论文
INTERNATIONAL JOURNAL OF ELECTROCHEMICAL SCIENCE, 2012, 卷号: 7, 期号: 3, 页码: 2680-2694
作者:  Li, Weihua;  Bai, Xue;  Yang, Fengke;  Hou, Baorong
收藏  |  浏览/下载:18/0  |  提交时间:2013/09/24


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