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浏览/检索结果: 共7条，第1-7条 帮助 限定条件 发表日期：2017     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 An Overview of Carbon Nanotubes Based Interconnects for Microelectronic Packaging 会议论文 2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01 作者:  Chen, Shujing[1];  Shan, Bo[2];  Yang, Yiqun[3];  Yuan, Guangjie[4];  Huang, Shirong[5] 收藏  |  浏览/下载：17/0  |  提交时间：2019/04/24 Interconnect  CNTs based bumps  CNTs basednTSVs  resistivity  CNTs-Cu nanocomposite   Improved Reliability of Electrically Conductive Adhesives Joints on Cu-Plated PCB Substrate Enhanced by Graphene Protection Barrier 会议论文 2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01 作者:  Huang, Shirong[1];  Ke, Wei[2];  Yang, Yiqun[3];  Ye, Hui[4];  Chen, Shujing[5] 收藏  |  浏览/下载：41/0  |  提交时间：2019/04/24 Graphene protection barrier  Cu-Plated PCB  Reliability   Effect of sintering method on properties of nanosilver paste 会议论文 2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01 作者:  Zhang, Qiaoran[1];  Liu, Jiawen[2];  Ke, Wei[3];  Huang, Shirong[4];  Latorre, Marti Gutierrez[5] 收藏  |  浏览/下载：16/0  |  提交时间：2019/04/24 nanosilver  sintering  thermal conductivity  shear strength   Graphene-based Heat Spreading Materials for Electronics Packaging Applications 会议论文 2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01 作者:  Yuan, Guangjie[1];  Shan, Bo[2];  Chen, Shujing[3];  Yang, Yiqun[4];  Bao, Jie[5] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/24 heat spreading materials  graphene-based film  graphene-based electrically conductive adhesive  electronics packaging   Heat Dissipation Performance of Graphene Enhanced Electrically Conductive Adhesive for Electronic Packaging 会议论文 2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01 作者:  Yang, Yiqun[1];  Ye, Hui[2];  Ke, Wei[3];  Huang, Shirong[4];  Wang, Nan[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/24 heat dissipation  silver coated graphene  electrically conductive adhesive   INVESTIGATION OF THERMAL INTERFACE MATERIALS REINFORCED WITH MICRO- AND NANOPARTICLES 会议论文 China Semiconductor Technology International Conference (CSTIC), 2017-03-12 作者:  Janeczek, Kamil[1];  Arazna, Aneta[2];  Zhang, Yan[3];  Ma, Shiwei[4] 收藏  |  浏览/下载：14/0  |  提交时间：2019/04/24 Efficient surface modification of carbon nanotubes for fabricating high performance CNT based hybrid nanostructures 期刊论文 CARBON, 2017, 卷号: 111, 页码: 402-410 作者:  Wang, Nan[1];  Pandit, Santosh[2];  Ye, Lilei[3];  Edwards, Michael[4];  Mokkapati, V. R. S. S.[5] 收藏  |  浏览/下载：9/0  |  提交时间：2019/04/24