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Graphene Based Heat Spreader for High Power Chip Cooling Using Flip-chip Technology 会议论文
Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC), 2013-12-11
作者:  Huang, Shirong[1];  Zhang, Yong[2];  Sun, Shuangxi[3];  Fan, Xiaogang[4];  Wang, Ling[5]
收藏  |  浏览/下载:10/0  |  提交时间:2019/04/30
Effect of substrates and underlayer on CNT synthesis by plasma enhanced CVD 期刊论文
ADVANCES IN MANUFACTURING, 2013, 卷号: 1, 页码: 236-240
作者:  Xu, Liang[1];  Jiang, Di[2];  Fu, Yi-Feng[3];  Xavier, Stephane[4];  Bansropun, Shailendra[5]
收藏  |  浏览/下载:3/0  |  提交时间:2019/04/30
Characterization for Graphene as Heat Spreader Using Thermal Imaging Method 会议论文
2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2013-08-11
作者:  Huang, Shirong[1];  Zhang, Yong[2];  Sun, Shuangxi[3];  Fan, Xiaogang[4];  Wang, Ling[5]
收藏  |  浏览/下载:4/0  |  提交时间:2019/04/30
Observation of a charged charmoniumlike structure in e+e- → π+π-J/φ at √s=4.26 GeV 期刊论文
Physical Review Letters, 2013, 卷号: 110, 期号: 25
作者:  Ablikim, Medina N./35226931500[0];  Achasov, M. N./7003450501[1];  Ai, Xiaocong/55770747000[2];  Albayrak, O./57084398500[3];  Ambrose, D. J./56999995000[4]
收藏  |  浏览/下载:51/0  |  提交时间:2019/12/06


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