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The effect of Pb contamination on the microstructure and mechanical properties of SnAg/Cu and SnSb/Cu solder joints in SMT 期刊论文
SOLDERING & SURFACE MOUNT TECHNOLOGY, 2000, 卷号: 12, 期号: 3, 页码: 19-23
Zhu, QN; Sheng, M; Luo, L
收藏  |  浏览/下载:43/0  |  提交时间:2012/03/24
Lead free solder alloys Sn-Zn and Sn-Sb prepared by mechanical alloying 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2000, 卷号: 11, 页码: 57-65
作者:  Huang, ML;  Wu, CML;  Lai, JKL;  Wang, L;  Wang, FG
收藏  |  浏览/下载:4/0  |  提交时间:2020/01/02


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