CORC

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Process Development of Thick Si Interposer for 2.5D Integration of RF MEMS Devices 其他
2016-01-01
Ren, Kuili; Ma, Shenglin; Ma, Feilong; Yan, Jun; Xia, Yanming; Luo, Rongfeng; Jin, Yufeng; Chen, Jing
收藏  |  浏览/下载:6/0  |  提交时间:2017/12/03
用于40Gb/s光电子器件的新型低成本硅基过渡热沉 期刊论文
2010, 2010
熊兵; 王健; 蔡鹏飞; 田建柏; 孙长征; 罗毅; Xiong Bing; Wang Jian; Cai Pengfei; Tian Jianbo; Sun Changzheng; Luo Yi
收藏  |  浏览/下载:7/0
A passive low-pass filter on low-loss substrate 期刊论文
2010, 2010
Fang Jie; Liu Zewen; Zhao Jiahao; Chen Zhongmin; Wei Jia; Liu Litian; Li Zhijian
收藏  |  浏览/下载:3/0
Novel low-cost wideband Si-based submount for 40 Gb/s optoelectronic devices 期刊论文
2010, 2010
Xiong, B; Wang, J; Cai, PF; Tian, JB; Sun, CZ; Luo, Y
收藏  |  浏览/下载:3/0
Effect of Zr addition on resistance to high temperature softening and resistivity of 6082 Al-Mg-Si alloys 会议论文
14TH CONGRESS OF INTERNATIONAL FEDERATION FOR HEAT TREATMENT AND SURFACE ENGINEERING, VOLS 1 and 2, PROCEEDINGS
作者:  Jin, M[1];  Sun, BL[2];  Zhang, PP[3];  Li, J[4];  Shao, GJ[5]
收藏  |  浏览/下载:2/0  |  提交时间:2019/05/10
Process Development of Thick Si Interposer for 2.5D Integration of RF MEMS Devices (CPCI-S收录) 会议
作者:  Ren, Kuili;  Ma, Shenglin[1];  Ma, Feilong;  Yan, Jun;  Xia, Yanming
收藏  |  浏览/下载:9/0  |  提交时间:2019/04/11


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