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A Health Monitoring Method for Bond Wires in IGBT Modules Based on Voltage Ringing Characteristics. 期刊论文
IEEE Transactions on Electron Devices, 2019, 卷号: Vol.66 No.9, 页码: 3953-3960
作者:  Lei, Jing;  Mingxing, Du;  Kexin, Wei;  Hurley, William Gerard
收藏  |  浏览/下载：14/0  |  提交时间：2019/11/21
Performance Improvement of Microwave Vector Modulator through Coupler Characteristic Impedance Optimization and Bond-wire Inductance Utilization 期刊论文
IEEE ACCESS, 2019, 卷号: 7, 页码: 6151-6160
作者:  Chen, Chen;  Dilshad, Umar;  Mehdi, Ghulam;  Wang, Chao;  Hu, Anyong
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/30
Reliability model of bond wire fatigue for IGBT in MMC with system redundancy consideration 期刊论文
MICROELECTRONICS RELIABILITY, 2018, 卷号: 88-90
作者:  Zheng, Tao;  Huang, Meng;  Liu, Yi;  Zha, Xiaoming
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/05
Multi-level virtual prototyping of electromechanical actuation system for more electric aircraft 期刊论文
CHINESE JOURNAL OF AERONAUTICS, 2018, 卷号: 31, 页码: 892-913
作者:  Fu, Jian;  Mare, Jean-Charles;  Yu, Liming;  Fu, Yongling
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/30
Packaging of High-Gain Multichip Module in Multilayer LCP Substrates at W-Band 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2017, 卷号: 7, 期号: 10, 页码: 1655-1662
作者:  Zhang, Yifei;  Shi, Shouyuan;  Martin, Richard D.;  Wright, Andrew A.;  Yao, Peng
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/11
Dynamics Modeling and Residual Vibration Control of a Piezoelectric Gripper During Wire Bonding 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2017, 卷号: 7, 期号: 12, 页码: 2045-2056
作者:  Long, Zhili;  Zhang, Jianguo;  Liu, Yuecai;  Han, Cuihong;  Li, Yanle
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/12
Modelling and simulation of flight control electromechanical actuators with special focus on model architecting, multidisciplinary effects and power flows 期刊论文
CHINESE JOURNAL OF AERONAUTICS, 2017, 卷号: 30, 页码: 47-65
作者:  Fu, Jian;  Maré, Jean-Charles;  Fu, Yongling
收藏  |  浏览/下载：15/0  |  提交时间：2019/12/30
Effect of silicone gel on the reliability of heavy aluminum wire bond for power module during thermal cycling test 会议论文
作者:  Xu, Ling;  Wang, Miaocao;  Zhou, Yang;  Qian, Zhengfang;  Liu, Sheng
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/05
Incremental Modelling and Simulation of Power Drive Electronics and Motor for Flight Control Electro-mechanical Actuators Application 会议论文
2015 IEEE INTERNATIONAL CONFERENCE ON MECHATRONICS AND AUTOMATION, 2015-01-01
作者:  Fu Jian;  Mare, Jean-Charles;  Fu Yongling;  Han Xu
收藏  |  浏览/下载：6/0  |  提交时间：2020/01/06
A Narrowband Low Noise Amplifier for Passive Imaging Systems 会议论文
2013 10TH INTERNATIONAL BHURBAN CONFERENCE ON APPLIED SCIENCES AND TECHNOLOGY (IBCAST), 2013-01-01
作者:  Mehdi, Ghulam;  Hu Anyong;  Miao Jungang
收藏  |  浏览/下载：4/0  |  提交时间：2020/01/06

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