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北京航空航天大学 [4]
清华大学 [3]
长春光学精密机械与物... [3]
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Life prediction methodology of system-in-package based on physics of failure
会议论文
MICROELECTRONICS RELIABILITY, 2018-09-01
作者:
Fu, Guicui
;
Su, Yutai
;
Guo, Wendi
;
Wan, Bo
;
Zhang, Zhongqing
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/12/30
System in package
Physics of failure
Competing failure
Life prediction
Life prediction methodology of system-in-package based on physics of failure
期刊论文
MICROELECTRONICS RELIABILITY, 2018, 卷号: 88-90, 页码: 173-178
作者:
Fu, Guicui
;
Su, Yutai
;
Guo, Wendi
;
Wan, Bo
;
Zhang, Zhongqing
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/30
System in package
Physics of failure
Competing failure
Life prediction
Drop analysis of 3D SiP with Through Silicon Via
会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:
Yao, Ruixia
;
Li, Tenghui
;
Huang, Pengfei
;
Su, Fei
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  |  
浏览/下载:5/0
  |  
提交时间:2019/12/30
3D System in Package with Through Silicon Via
Finite Element Analysis
drop/impact
reliability
Research on Model Based Reliability System Engineering Methodology of System in Package
会议论文
2017 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS), 2017-01-01
作者:
Su, Yutai
;
Fu, Guicui
;
Wang, Ye
;
Leng, Hongyan
;
Gu, Hantian
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/30
Model Based Reliability System Engineering
System in Package
Reliability Models
Fabrication and Characterization of Low Stress Si Interposer with Air-gapped Si Interconnection for Hermetical System-in-Package
其他
2016-01-01
Luo, Rongfeng
;
Ren, Kuili
;
Ma, Shenglin
;
Yan, Jun
;
Xia, Yanming
;
Jin, Yufeng
;
Chen, Jing
;
Wu, Tianzhun
;
Yang, Hangao
;
Yuan, Lifang
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  |  
浏览/下载:5/0
  |  
提交时间:2017/12/03
Air-gapped Si
Si interposer
low stress
hermetical
System-in-Package
MEMS
WAFER-LEVEL
MEMS RESONATORS
TSV INTERPOSERS
VACUUM
MEMBRANES
DEVICES
SENSORS
Integrated Manufacturing of Microphone-array Node for Wireless Sensor Network (WSN)
会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), 2016-08-16
作者:
Xu, Gaowei[1]
;
Gai, Wei[2]
;
Zheng, Tao[3]
;
Liang, Defeng[4]
;
Luo, Le[5]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/26
System integration
system in package (SiP)
stacked interconnection
MEMS microphone
integration node
Research of software re-injection technology for aerospace camera controller in-orbit (EI CONFERENCE)
会议论文
2012 9th IEEE International Conference on Mechatronics and Automation, ICMA 2012, August 5, 2012 - August 8, 2012, Chengdu, China
Xu W.
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浏览/下载:15/0
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提交时间:2013/03/25
For the factors of increased of tasks
enhancements of functions and improvement of integrity and complexity in aerospace camera
application system has raised high and long-term in-orbit autonomy and reliability requirements on camera controller. Based on an actual project application background
this paper has put forward a design method of new high reliability aerospace camera controller in-orbit software reinjection instruction sequence which use TSC695F as kernel CPU and process flow of bootstrap receive
cache
checkout and storage update data. Finally
combined with specific test module for camera controller software re-injection
the validity of the software re-injection method raised here has been verified. Still here gives out reference codes of update data package which generated by the ground. 2012 IEEE.
Recent development of electronic packaging technology
期刊论文
2010, 2010
Fu Yuepeng
;
Tan Kai
;
Tian Minbo
收藏
  |  
浏览/下载:4/0
Load balancing of the vehicle routing problem
期刊论文
2010, 2010
Dan Zhenggang
;
Cai Linning
;
Du Lili
;
Zheng Li
收藏
  |  
浏览/下载:3/0
Performance analysis of the NAT-PT protocol based on stochastic Petri net
期刊论文
2010, 2010
Chen Xiao
;
Xu Mingwei
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  |  
浏览/下载:3/0
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