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浏览/检索结果: 共11条，第1-10条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Geometrical Effects of Cu@Ag Core-Shell Nanoparticles Treated Flux on the Growth Behaviour of Intermetallics in Sn/Cu Solder Joints 期刊论文 ELECTRONIC MATERIALS LETTERS, 2019, 卷号: 15, 页码: 253-265 作者:  Shang, Shengyan;  Kunwar, Anil;  Wang, Yanfeng;  Yao, Jinye;  Wu, Yingchao 收藏  |  浏览/下载：29/0  |  提交时间：2019/12/02 Electronic materials  Intermetallic compounds  Crystal growth  Thermogravimetric analysis  Diffusion  Finite element method   Geometrical effects on growth kinetics of interfacial intermetallic compounds in Sn/Cu joints reflowed with Cu nanoparticles doped flux 期刊论文 THIN SOLID FILMS, 2019, 卷号: 669, 页码: 198-207 作者:  Shang, Shengyan;  Kunwar, Anil;  Yao, Jinye;  Ma, Haitao;  Wang, Yunpeng 收藏  |  浏览/下载：20/0  |  提交时间：2019/12/02 Solder  Intermetallic compounds film  Nanoparticles  Growth kinetics  Finite element method   Effect of the TiO2 Nanoparticles on the Growth Behavior of Intermetallics in Sn/Cu Solder Joints 期刊论文 METALS AND MATERIALS INTERNATIONAL, 2019, 卷号: 25, 页码: 499-507 作者:  Shang, Shengyan;  Kunwar, Anil;  Yao, Jinye;  Wang, Yanfeng;  Ma, Haitao 收藏  |  浏览/下载：27/0  |  提交时间：2019/12/02 TiO2 nanoparticles  Intermetallic compounds  Ostwald ripening  von Mises stress  Solder  Interface   Broadband Laser Doppler Frequency Shift Emulator for Satellite Laser Communication 期刊论文 IEEE Photonics Journal, 2019, 卷号: 11, 期号: 6, 页码: 5503612 作者:  Jinye Li;  Yuan Yao;  Guozhang Wu;  Jiaqing Hou;  Wenqi Yu;  Bo Liu;  Jianguo Liu;   Member, IEEE 收藏  |  浏览/下载：10/0  |  提交时间：2020/07/31 Effect of Ag content on Cu6Sn5 growth behavior at Sn-Ag/Cu solder interface during multiple reflows 会议论文 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01 作者:  Ma, Haoran;  Yao, Jinye;  Wang, Chen;  Shang, Shengyan;  Wang, Yunpeng 收藏  |  浏览/下载：6/0  |  提交时间：2019/12/02 Soldering  Interface  Nanoparticles  Growth kinetics  Diffusion   Mechanism of Cu5Zn8 layer act as a diffusion barrier layer 会议论文 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01 作者:  Yao, Jinye;  Li, Hua;  Huang, Ru;  Qi, Xiao;  Wang, Boyin 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/02 Cu5Zn8  interfacial intermetallic compounds  lead-free solder  growth kinetics   Effect of soldering temperature on cross-interaction at L-S interface of linear Cu/SAC305/Ni solder joints 会议论文 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01 作者:  Guo, Bingfeng;  Huang, Ru;  Yao, Jinye;  Qi, Xiao;  Kunwar, Anil 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02 Intermetalic  Linear solder joint  Temperature  Cross-interaction  Mechanism   Size Effect of Interfacial Reaction in Sn-0.7Cu/Cu solder under Multiple Reflow 会议论文 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01 作者:  Huang, Ru;  Xia, Mengrou;  Yao, Jinye;  Wang, Boyin;  Qi, Xiao 收藏  |  浏览/下载：6/0  |  提交时间：2019/12/02 multipie reflow  size effect  interface reaction  intermetallic compound   Study on Electrochemical Migration of Sn-0.7Cu 会议论文 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01 作者:  Qi, Xiao;  Ma, Haoran;  Huang, Ru;  Yao, Jinye;  Shang, Shengyan 收藏  |  浏览/下载：9/0  |  提交时间：2019/12/02 electronic packaging  SEM  Sn0.7Cu  deposits  electrochemical migration  EDS  XRD   Influence of Cu nanoparticles on Cu6Sn5 growth behavior at the interface of Sn/Cu solder joints 会议论文 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01 作者:  Shang, Shengyan;  Kunwar, Anil;  Wang, Yanfeng;  Yao, Jinye;  Ma, Haitao 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02 Nanoparticles  Intermetallic compounds  Screw dislocation  Finite element method  Solder