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浏览/检索结果: 共13条，第1-10条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Fabrication and Characterization of Low Stress Si Interposer with Air-gapped Si Interconnection for Hermetical System-in-Package 会议论文 2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), Las Vegas, NV 作者:  Luo, Rongfeng;  Ren, Kuili;  Ma, Shenglin;  Yan, Jun;  Xia, Yanming 收藏  |  浏览/下载：42/0  |  提交时间：2017/01/15 Fabrication and Characterization of Low Stress Si Interposer with Air-gapped Si Interconnection for Hermetical System-in-Package 其他 2016-01-01 Luo, Rongfeng; Ren, Kuili; Ma, Shenglin; Yan, Jun; Xia, Yanming; Jin, Yufeng; Chen, Jing; Wu, Tianzhun; Yang, Hangao; Yuan, Lifang 收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03 Air-gapped Si  Si interposer  low stress  hermetical  System-in-Package  MEMS  WAFER-LEVEL  MEMS RESONATORS  TSV INTERPOSERS  VACUUM  MEMBRANES  DEVICES  SENSORS   Process Development of a New TGV Interposer for Wafer Level Package of Inertial MEMS Device 其他 2016-01-01 Ma, Shenglin; Ren, Kuili; Xia, Yanming; Yan, Jun; Luo, Rongfeng; Cai, Han; Jin, Yufeng; Ma, Mingjun; Jin, Zhonghe; Chen, Jing 收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03 TGV interposer  Al RDL  Wafer level packaging  Inertial devices   Design and Characterization of Petaloid Hollow Cu Interconnection for Interposer 其他 2016-01-01 Xia, Yanming; Ren, Kuili; Ma, Shenglin; Guan, Yong; Cai, Han; Luo, Rongfeng; Yan, Jun; Chen, Jing; Jin, Yufeng 收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03 petaloid hollow Cu interconnection  3D TSV interposer  thermal-mechanical simulation  influence on electrical property   Process Development of Thick Si Interposer for 2.5D Integration of RF MEMS Devices 其他 2016-01-01 Ren, Kuili; Ma, Shenglin; Ma, Feilong; Yan, Jun; Xia, Yanming; Luo, Rongfeng; Jin, Yufeng; Chen, Jing 收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03 Thick TSV interposer  high resistivity Si  CPW  Micro-strip  inductor   Fabrication and characterization of a tungsten microneedle array based on deep reactive ion etching technology 期刊论文 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2016 Ma, Shenglin; Xia, Yanming; Wang, Yaohua; Ren, Kuili; Luo, Rongfeng; Song, Lu; Chen, Xian; Chen, Jing; Jin, Yufeng 收藏  |  浏览/下载：3/0  |  提交时间：2017/12/04 DELIVERY  ELECTRODE  HYDROGEL  DEVICES   Design, Fabrication and Stress Evaluation of Si Electrical Interconnection Air-gapped from Si Interposer 会议论文 2015 16TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, 2015-01-01 作者:  Ma, Shenglin;  Xia, Yanming;  Luo, Rongfeng;  Ren, Kuili;  Chen, Jing 收藏  |  浏览/下载：3/0  |  提交时间：2020/01/06 Low stress  Air-gapped Si  TSV Interposer   Process Development of Thick Si Interposer for 2.5D Integration of RF MEMS Devices (CPCI-S收录) 会议 作者:  Ren, Kuili;  Ma, Shenglin[1];  Ma, Feilong;  Yan, Jun;  Xia, Yanming 收藏  |  浏览/下载：9/0  |  提交时间：2019/04/11 Thick TSV interposer  high resistivity Si  CPW  Micro-strip  inductor   Fabrication and Characterization of Low Stress Si Interposer with Air-gapped Si Interconnection for Hermetical System-in-Package (CPCI-S收录) 会议 作者:  Luo, Rongfeng[1];  Ren, Kuili[1];  Ma, Shenglin[1];  Yan, Jun[1];  Xia, Yanming[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 Air-gapped Si  Si interposer  low stress  hermetical  System-in-Package  MEMS   Process Development of a New TGV Interposer for Wafer Level Package of Inertial MEMS Device (CPCI-S收录) 会议 作者:  Ma, Shenglin[1];  Ren, Kuili[1];  Xia, Yanming[1];  Yan, Jun[1];  Luo, Rongfeng[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 TGV interposer  Al RDL  Wafer level packaging  Inertial devices