QQ客服 官方微博 反馈留言

浏览/检索结果: 共7条，第1-7条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Coupling stress caused by thermal and slicing force in KDP crystal slicing with fixed abrasive wire saw 期刊论文 INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2018, 卷号: 96, 期号: 9-12, 页码: 4333-4343 作者:  Li, Zongqiang;  Ge, Peiqi;  Bi, Wenbo;  Liu, Tengyun;  Wang, Peizhi 收藏  |  浏览/下载：6/0  |  提交时间：2019/12/11 KDP crystal  Fixed abrasive wire saw  Temperature field  Coupling stress  of slicing force and thermal stress   Stress analysis in scratching of anisotropic single-crystal silicon carbide 期刊论文 INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, 2018, 卷号: 141, 页码: 1-8 作者:  Wang, Peizhi;  Ge, Peiqi;  Bi, Wenbo;  Liu, Tengyun;  Gao, Yufei 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/11 Stress field  Scratch test  Single-crystal silicon carbide  Median crack   Effect of wire speed on subsurface cracks in wire sawing process of single crystal silicon carbide 期刊论文 ENGINEERING FRACTURE MECHANICS, 2017, 卷号: 184, 页码: 273-285 作者:  Wang, Peizhi;  Ge, Peiqi;  Bi, Wenbo;  Ge, Mengran;  Liu, Tengyun 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/12 Wire speed  Dynamic stress intensity factors  Single crystal silicon  carbide  Subsurface crack   Fracture strength of silicon wafers sawn by fixed diamond wire saw 期刊论文 SOLAR ENERGY, 2017, 卷号: 157, 页码: 427-433 作者:  Liu, Tengyun;  Ge, Peiqi;  Bi, Wenbo;  Wang, Peizhi 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/12 Fracture strength  Silicon wafer  Surface crack  Fixed diamond wire saw   The first all-season sample set for mapping global land cover with Landsat-8 data 期刊论文 SCIENCE BULLETIN, 2017, 卷号: 62, 期号: 7, 页码: 508-515 作者:  Li, Congcong[1];  Gong, Peng[2];  Wang, Jie[3];  Zhu, Zhiliang[4];  Biging, Gregory S.[5] 收藏  |  浏览/下载：7/0  |  提交时间：2019/12/23 Training sample  Validation  Latitudinal zones  Anytime  Anywhere   Experiment study on electroplated diamond wire saw slicing single-crystal silicon 期刊论文 MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2016, 卷号: 56, 页码: 106-114 作者:  Gao, Yufei;  Ge, Peiqi;  Liu, Tengyun 收藏  |  浏览/下载：6/0  |  提交时间：2019/12/16 Electroplated diamond wire  Wire saw machining  Single-crystal silicon  Wafer slicing  Wafer quality   Comparison of strontium and calcium adsorption onto composite magnetic particles derived from Fe3O4 and bis(trimethoxysilylpropyl)amine 期刊论文 COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS, 2008, 卷号: 330, 期号: 1, 页码: 21-27 作者:  Ye, Xiushen;  Liu, Tengyun;  Li, Quan;  Liu, Haining;  Wu, Zhijian 收藏  |  浏览/下载：3/0  |  提交时间：2018/06/20 Strontium  Calcium  Composite Magnetic Particle  Adsorption  Separation Factor