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浏览/检索结果: 共10条，第1-10条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Templated Growth of Covalently Bonded Three-Dimensional Carbon Nanotube Networks Originated from Graphene 期刊论文 ADVANCED MATERIALS, 2012, 卷号: 24, 页码: 1576-1581 作者:  Fu, Yifeng[1];  Carlberg, Bjorn[2];  Lindahl, Niklas[3];  Lindvall, Niclas[4];  Bielecki, Johan[5] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/30 graphene  carbon nanotube  templated growth  covalent bonding  mechanical strength   Coffin-Manson equation determination for Sn-Zn based lead-free solder joints 会议论文 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05, 2005-06-27 作者:  Sun, Peng[1];  Andersson, Cristina[2];  Cheng, Zhaonian[3];  Lai, Zonghe[4];  Shangguan, Dongkai[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/05/10 Design for embedded Chinese display smart card 会议论文 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06, 2006-06-27 作者:  Zhou, Hua[1];  Liu, Yang[2];  Kolev, Dimitar Antonov[3];  Chen, Jingjing[4];  Lai, Zonghe[5] 收藏  |  浏览/下载：3/0  |  提交时间：2019/05/10 Adhesion study of copper layer deposited onto liquid crystalline polymer for electronic packaging 会议论文 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05, 2005-06-27 作者:  Zhang, Qi[1];  Nyborg, Lars[2];  Jelvestam, Urban[3];  Lai, Zonghe[4];  Cheng, Zhaonian[5] 收藏  |  浏览/下载：1/0  |  提交时间：2019/05/10 High temperature aging study of intermetallic compound formation of Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on electroless Ni (P) metallization 会议论文 56th Electronic Components & Technology Conference 2006, Vol 1 and 2, Proceedings, 2006-05-30 作者:  Sun, Peng[1];  Andersson, Cristina[2];  Wei, Xicheng[3];  Cheng, Zhaonian[4];  Lai, Zonghe[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/05/10 Coffin-Manson equation determination for Sn-Zn based lead-free solder joints 会议论文 Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05) 作者:  Sun, Peng[1];  Andersson, Cristina[2];  Cheng, Zhaonian[3];  Lai, Zonghe[4];  Shangguan, Dongkai[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/05/10 Coffin-Manson equation determination for Sn-Zn based lead-free solder joints 会议论文 Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05) 作者:  Sun, Peng[1];  Andersson, Cristina[2];  Cheng, Zhaonian[3];  Lai, Zonghe[4];  Shangguan, Dongkai[5] 收藏  |  浏览/下载：1/0  |  提交时间：2019/05/10 Coffin-Manson equation determination for Sn-Zn based lead-free solder joints 会议论文 Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05) 作者:  Sun, Peng[1];  Andersson, Cristina[2];  Cheng, Zhaonian[3];  Lai, Zonghe[4];  Shangguan, Dongkai[5] 收藏  |  浏览/下载：1/0  |  提交时间：2019/05/10 Coffin-Manson equation determination for Sn-Zn based lead-free solder joints 会议论文 Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05) 作者:  Sun, Peng[1];  Andersson, Cristina[2];  Cheng, Zhaonian[3];  Lai, Zonghe[4];  Shangguan, Dongkai[5] 收藏  |  浏览/下载：1/0  |  提交时间：2019/05/10 High frequency flip chip interconnection on liquid crystal polymer substrate using anisotropic conductive adhesive 会议论文 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004-09-12 作者:  Zou, Gang[1];  Gr?nqvist, Hans[2];  Lai, Zonghe[3];  S?dervall, Ulf[4];  Liu, Johan[5] 收藏  |  浏览/下载：6/0  |  提交时间：2019/05/10