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One-step electrodeposition of superhydrophobic copper coating from ionic liquid 期刊论文
MATERIALS LETTERS, 2021, 卷号: 303, 页码: 4
作者:  Kuang, Yilong;  Jiang, Fan;  Zhu, Tianqi;  Wu, Hongyan;  Yang, Xinye
收藏  |  浏览/下载:38/0  |  提交时间:2021/10/15
The Study of the Stand Simulation Based on the Spatial Structure 会议论文
2012 IEEE 4th International Symposium on Plant Growth Modeling,Simulation,Visualization and Applications(PMA 2012), 中国上海, 2012-10-31
作者:  Kuang Yilong;  Zhang Huaiqing*;  Tan Junshan;  Jiang Xian;  Lu Kangning
收藏  |  浏览/下载:2/0  |  提交时间:2019/12/28


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