CORC

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CORC

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Effect of eddy current inducted heating on optical property and thermostability of high power LED 期刊论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, 页码: 819-822
作者:  Chen, Jibing*;  Wan, Nong;  Li, Juying;  He, Zhanwen;  Wu, Yiping
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/27
Effect of rapid inducted heating on the microstructure of solder joint in IC 会议论文
19th International Conference on Electronic Packaging Technology (ICEPT), Inst Microelectron Chinese Acad Sci, Shanghai, PEOPLES R CHINA, AUG 08-11, 2018
作者:  Chen, Jibing*;  Wan, Nong;  Li, Juying;  He, Zhanwen;  Wu, Yiping
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/27
Study on Interfacial Diffusion Mechanism of The Nonstoichiometric ratio TiN0.3 and AlN composite in the process of sintering 会议论文
19th International Conference on Electronic Packaging Technology (ICEPT), Inst Microelectron Chinese Acad Sci, Shanghai, PEOPLES R CHINA, AUG 08-11, 2018
作者:  He, ZhanWen*;  Wang, M. Z.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/27
Study on the polymer material infiltrating metallic parts by selective laser sintering of 3D printing 期刊论文
Rapid Prototyping Journal, 2018, 卷号: 24, 期号: 9, 页码: 1539-1543
作者:  Chen, Jibing*;  Wan, Nong;  Li, Juying;  He, Zhanwen
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/27
Properties analysis of composite materials for the manufacture of space mirror 会议论文
Xi'an, China, 2017-08-20
作者:  Yang, Zhiyong;  Lei, Qin;  Pan, Lingying;  Tang, Zhanwen;  Xie, Yongjie
收藏  |  浏览/下载：43/0  |  提交时间：2018/10/15
CURE DEFORMATION ANALYSIS OF CURVED COMPOSITE HONEYCOMB SANDWICH STRUCTURE 会议论文
PROCEEDINGS OF THE 7TH INTERNATIONAL CONFERENCE ON MECHANICS AND MATERIALS IN DESIGN (M2D2017), 2017-01-01
作者:  Yang, Zhiyong;  Tang, Zhanwen;  Zhang, Zhenyu;  Shi, Hanqiao;  He, Xijun
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/30
Research on microstructures of double interfaces SAC305 solder joint by RPC 会议论文
18th International Conference on Electronic Packaging Technology (ICEPT), IEEE, Harbin, PEOPLES R CHINA, AUG 16-19, 2017
作者:  Chen, Jibing*;  Wan, Nong;  Li, Juying;  He, Zhanwen;  Wu, Yiping
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/27
Performances and microstructures of a high-power LED based on rapid thermal cycling 会议论文
18th International Conference on Electronic Packaging Technology (ICEPT), IEEE, Harbin, PEOPLES R CHINA, AUG 16-19, 2017
作者:  Chen, Jibing*;  Wan, Nong;  Li, Juying;  He, Zhanwen;  Wu, Yiping
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/27
A comparative study of properties and microstructures on thermal fatigue testing of a High-power LED 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, AUG 16-19, 2016
作者:  Chen, Jibing*;  Wan, Nong;  Li, Juying;  He, Zhanwen;  Wu, Yiping
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/27
Study on thermal fatigue characteristics of lead-free SAC305 solder joint by RPC 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, AUG 16-19, 2016
作者:  Chen, Jibing*;  Wan, Nang;  Li, Juying;  He, Zhanwen;  Wu, Yiping
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/27

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