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Nucleation location and propagation direction of radial and median cracks for brittle material in scratching 期刊论文
CERAMICS INTERNATIONAL, 2019, 卷号: 45, 期号: 6, 页码: 7524-7536
作者:  Li, Xinying;  Gao, Yufei;  Ge, Peiqi;  Zhang, Lei;  Bi, Wenbo
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/11
The effect of cut depth and distribution for abrasives on wafer surface morphology in diamond wire sawing of PV polycrystalline silicon 期刊论文
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2019, 卷号: 91, 页码: 316-326
作者:  Li, Xinying;  Gao, Yufei;  Ge, Peiqi;  Zhang, Lei;  Bi, Wenbo
收藏  |  浏览/下载：16/0  |  提交时间：2019/12/11
Interaction of lateral cracks in double scratching of single-crystal silicon carbide 期刊论文
Theoretical and Applied Fracture Mechanics, 2019, 卷号: 104
作者:  Wang, Peizhi;  Ge, Peiqi;  Bi, Wenbo;  Meng, Jianfeng
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/11
Material removal and surface generation mechanisms in diamond wire sawing of silicon crystal 期刊论文
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2019, 卷号: 103
作者:  Gao, Yufei;  Ge, Peiqi;  Zhang, Lei;  Bi, Wenbo
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/11
Material removal mechanism and crack propagation in single scratch and double scratch tests of single-crystal silicon carbide by abrasives on wire saw 期刊论文
CERAMICS INTERNATIONAL, 2019, 卷号: 45, 期号: 1, 页码: 384-393
作者:  Wang, Peizhi;  Ge, Peiqi;  Ge, Mengran;  Bi, Wenbo;  Meng, Jianfeng
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/11
Investigation on residual scratch depth and material removal rate of scratching machining single crystal silicon with Berkovich indenter 期刊论文
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2019, 卷号: 100, 页码: 98-105
作者:  Ge, Mengran;  Zhu, Hongtao;  Ge, Peiqi;  Zhang, Cheng
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/11
Experimental study of rectangular groove texture in the surface of photovoltaic silicon with diamond coated micro-milling tools 期刊论文
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2018, 卷号: 86, 页码: 23-35
作者:  Wu, Yuantai;  Zhang, Lei;  Ge, Peiqi;  Gao, Yufei
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/11
Coupling stress caused by thermal and slicing force in KDP crystal slicing with fixed abrasive wire saw 期刊论文
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2018, 卷号: 96, 期号: 9-12, 页码: 4333-4343
作者:  Li, Zongqiang;  Ge, Peiqi;  Bi, Wenbo;  Liu, Tengyun;  Wang, Peizhi
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/11
Numerical study on the heat transfer enhancement and fatigue life by flow-induced vibration 期刊论文
CHEMICAL ENGINEERING RESEARCH & DESIGN, 2018, 卷号: 132, 页码: 652-663
作者:  Duan, Derong;  Ge, Peiqi;  Bi, Wenbo
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/11
Stress analysis in scratching of anisotropic single-crystal silicon carbide 期刊论文
INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, 2018, 卷号: 141, 页码: 1-8
作者:  Wang, Peizhi;  Ge, Peiqi;  Bi, Wenbo;  Liu, Tengyun;  Gao, Yufei
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/11

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