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浏览/检索结果: 共8条，第1-8条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Expert consensus on perioperative immunotherapy for local advanced non-small cell lung cancer 期刊论文 TRANSLATIONAL LUNG CANCER RESEARCH, 2021, 卷号: 10 作者:  Qiu, Bin;  Cai, Kaican;  Chen, Chun;  Chen, Jun;  Chen, Ke-Neng 收藏  |  浏览/下载：59/0  |  提交时间：2022/01/10 Independent and joint associations of blood lipids and lipoproteins with lung cancer risk in Chinese males: A prospective cohort study 期刊论文 2019, 卷号: 144, 期号: 12, 页码: 2972-2984 作者:  Lyu, Zhangyan;  Li, Ni;  Wang, Gang;  Feng, Xiaoshuang;  Chen, Shuohua 收藏  |  浏览/下载：37/0  |  提交时间：2020/01/03 lung cancer  blood lipids  joint associations  prospective cohort  Chinese males   Sleep duration and the risk of cancer: a systematic review and meta-analysis including dose-response relationship 期刊论文 2018, 卷号: 18, 期号: 1, 页码: 1149 作者:  Chen, Yuheng;  Tan, Fengwei;  Wei, Luopei;  Li, Xin;  Lyu, Zhangyan 收藏  |  浏览/下载：9/0  |  提交时间：2020/01/03 Cancer incidence  Sleep duration  Categorical meta-analysis  Dose-response meta-analysis   Novel spray coating process with polymer material applied in CIS wafer-level-packaging 会议论文 2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014, Singapore, Singapore 作者:  Yuechen Zhuang;  Daquan Yu;  Fengwei Dai;  Zhongcai Niu;  Wenqi Zhang 收藏  |  浏览/下载：31/0  |  提交时间：2015/09/01 Spray coating process with polymer material for insulation in CIS-TSV wafer-level-packaging 会议论文 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014, Chengdu, China 作者:  Yuechen Zhuang;  Daquan Yu;  Fengwei Dai;  Guoping Zhang;  Jun Fan 收藏  |  浏览/下载：33/0  |  提交时间：2015/09/01 The research on the improved CMG tool for Al2O3 ceramic 会议论文 2nd International Conference on Frontiers of Manufacturing and Design Science (ICFMD 2011), Taiwan, TAIWAN, 2011-12-11 作者:  Dai, Hengzhen;  Jin, Zhuji;  Gao, Shang;  Tao, Zhanchun;  Huo, Fengwei 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/13 Al2O3 Ceramic  SiO2 abrasive  Diamond  CMG  CMG tool   Numerical Simulation and Experimental Verification of Copper Plating with Different Additives for Through Silicon Vias 会议论文 4th Electronic System-Integration Technology Conference (ESTC), Amsterdam, NETHERLANDS, 2012-09-17 作者:  Song, Chongshen;  Wu, Heng;  Jing, Xiangmeng;  Dai, Fengwei;  Yu, Daquan 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/18 Research on chemical resistance characteristics of water-immersed coal with different metamorphic degrees 期刊论文 Scientific Reports, 卷号: 12, 期号: 1 作者:  Xun Zhang;  Mengfan Zhao;  Jing Yang;  Bing Lu;  Gang Wang 收藏  |  浏览/下载：17/0  |  提交时间：2022/09/16