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Light emitting diodes and methods 专利
专利号: US20180076368A1, 申请日期: 2018-03-15, 公开日期: 2018-03-15
作者:  HUSSELL, CHRISTOPHER P.
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/30
Tailored surface chemistry of SiO2 particles with improved rheological, thermal-mechanical and adhesive properties of epoxy based composites for underfill applications 期刊论文
POLYMER, 2018
作者:  Li, Gang;  He, Yachuan;  Zhu, Pengli;  Zhao, Tao;  Sun, Rong
收藏  |  浏览/下载：20/0  |  提交时间：2019/01/31
A Further Study on the Analytical Model for the Permeability in Flip-Chip Packaging 期刊论文
JOURNAL OF ELECTRONIC PACKAGING, 2018, 卷号: 140
作者:  Yao, X. J.[1];  Fang, J. J.[2];  Zhang, Wenjun[3]
收藏  |  浏览/下载：5/0  |  提交时间：2019/04/24
An Analytical Model for Permeability of Underfill Flow in Flip-Chip Packaging With Consideration of the Actual Specific Surface and Tortuosity 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 页码: 1507-1514
作者:  Yao, Xing Jun[1];  Zhang, Wen Jun[2]
收藏  |  浏览/下载：5/0  |  提交时间：2019/04/22
Effects of processing parameters on underfill defects in deep penetration laser welding of thick plates. 期刊论文
International Journal of Advanced Manufacturing Technology, 2018, 卷号: Vol.96 No.1-4, 页码: 491-501
作者:  Zhang, Mingjun;  Tang, Kun;  Zhang, Jian;  Mao, Cong;  Hu, Yongle
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/26
Analysis of mechanisms of underfill in full penetration laser welding of thick stainless steel with a 10 kW fiber laser 期刊论文
Optics and Laser Technology, 2018, 卷号: Vol.98, 页码: 97-105
作者:  Zhang, MJ;  Zhang, Z;  Tang, K;  Mao, C;  Hu, YL
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/26
Surface modification of nano-size SiO2 filler for flip chip underfill applications 会议论文
Harbin
作者:  Gang Li;  yachuan He;  Pengli Zhu;  Tao Zhao;  Rong Sun
收藏  |  浏览/下载：36/0  |  提交时间：2018/02/02
Influence of Viscoelastic Underfill on Thermal Mechanical Reliability of a 3-D-TSV Stack by Simulation 期刊论文
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2017
Zeng, Qinghua; Guan, Yong; Su, Fei; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Influence of Viscoelastic Underfill on Thermal Mechanical Reliability of a 3-D-TSV Stack by Simulation 期刊论文
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2017, 卷号: 17, 页码: 340-348
作者:  Zeng, Qinghua;  Guan, Yong;  Su, Fei;  Chen, Jing;  Jin, Yufeng
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/30
Novel Underfill Material Having Low Coefficeint of Thermal Expansione 会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者:  Zhang Baotan;  Sun Rong;  Zhu Pengli
收藏  |  浏览/下载：16/0  |  提交时间：2017/01/15

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