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CORC

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Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2022, 页码: 11
作者:  Chen, Yinbo;  Gao, Zhaoqing;  Liu, Zhi-Quan
收藏  |  浏览/下载：10/0  |  提交时间：2022/07/01
Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 15
作者:  Chen, Yinbo;  Meng, Zhi-Chao;  Gao, Li-Yin;  Liu, Zhi-Quan
收藏  |  浏览/下载：12/0  |  提交时间：2021/03/15
Microlenses arrays: Fabrication, materials, and applications 期刊论文
Microscopy Research and Technique, 2021, 卷号: 84, 期号: 11, 页码: 2784-2806
作者:  Cai SX(蔡树向);  Sun, Yalin;  Chu HH(褚洪汇);  Yang WG(杨文广);  Yu HB(于海波)
收藏  |  浏览/下载：19/0  |  提交时间：2021/05/25
Influences of different barrier films on microstructures and electrical properties of Bi2Te3-based joints 期刊论文
Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 17, 页码: 14714-14729
作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin
收藏  |  浏览/下载：16/0  |  提交时间：2020/11/14
Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9
作者:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan
收藏  |  浏览/下载：46/0  |  提交时间：2021/02/02
Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9
作者:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan
收藏  |  浏览/下载：42/0  |  提交时间：2021/02/02
Influences of Ni addition into Cu–xNi alloy on the microstructure evolution and mechanical property of Sn–58Bi/Cu–xNi solder joint 期刊论文
Applied Physics A: Materials Science and Processing, 2020, 卷号: 126, 期号: 4
作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin;  Jiang, Xiongxin
收藏  |  浏览/下载：4/0  |  提交时间：2020/11/14
Highly solderability of FeP film in contact with SnAgCu solder 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2020, 卷号: 818, 页码: 6
作者:  Zhou, Haifei;  Guo, Jingdong;  Shang, Jianku;  Song, Xiaoning
收藏  |  浏览/下载：12/0  |  提交时间：2021/02/02
Fabrication of refractive silicon microlens array with a large focal number and accurate lens profile 期刊论文
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS
作者:  Zhou, Xiaojun;  Song, Aiguo;  Wang, Shuai;  Wang, Mengjia;  Yu, Weixing
收藏  |  浏览/下载：103/0  |  提交时间：2019/10/28
Effect of Cu concentration on the interfacial reactions between Sn-xCu solders and Cu substrate 期刊论文
MATERIALS RESEARCH EXPRESS, 2019, 卷号: 6, 期号: 7
作者:  Bao, Nifa;  Hu, Xiaowu;  Li, Qinglin;  Li, Shuang
收藏  |  浏览/下载：10/0  |  提交时间：2019/11/15

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