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Preparation and Thermal Analysis of the nano-silver/Graphene composite material for packaging module 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Liu, Dongjing[1];  Fan, Yasong[2];  Yan, Haidong[3];  Lin, Haiying[4];  Zhu, Haidong[5]
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