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Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2017, 卷号: 46, 期号: 8, 页码: 5338-5348
Gao, Li-Yin; Liu, Zhi-Quan; Li, Cai-Fu
收藏  |  浏览/下载:34/0  |  提交时间:2017/08/17
Life Test of the InGaAs Focal Plane Arrays Detector for Space Applications 会议论文
作者:  Zhu XL;  Zhang HY;  Li X;  Huang ZC;  Gong HM
收藏  |  浏览/下载:22/0  |  提交时间:2018/11/20
Semantic linking through spaces for cyber-physical-socio intelligence: A methodology 期刊论文
ARTIFICIAL INTELLIGENCE, 2011, 卷号: 175, 期号: 5-6, 页码: 988-1019
作者:  Zhuge, Hai
收藏  |  浏览/下载:14/0  |  提交时间:2019/12/16
Effects of tetrabutoxytitanium on photoelectrochemical properties of plastic-based TiO2 film electrodes for flexible dye-sensitized solar cells 期刊论文
电源杂志, 2011
Fan, Ke; Peng, Tianyou; Chen, Junnian; Dai, Ke
收藏  |  浏览/下载:4/0  |  提交时间:2015/11/12
阵列化互连LED模组寿命分布的蒙特卡洛模拟 期刊论文
2011
郑同场; 李炳乾; 夏正浩
收藏  |  浏览/下载:4/0  |  提交时间:2016/05/17
Study of hydrogen embrittlement of Fe-Ni base alloy by positron annihilation lifetime spectroscopy 期刊论文
ACTA METALLURGICA SINICA, 2006, 卷号: 42, 期号: 5, 页码: 469-473
作者:  Zhang, J;  Li, XY;  Rong, LJ;  Zheng, YN;  Zhu, SY
收藏  |  浏览/下载:0/0  |  提交时间:2021/02/02
Electromechanical and optical properties of torsion-mirror actuators for optical switching applications 其他
2002-01-01
Wu, WG; Li, DC; Hao, YL; Yan, GZ; Jin, SJ
收藏  |  浏览/下载:3/0  |  提交时间:2015/11/13
Reliability estimation model of IC's interconnect based on uniform distribution of defects on a chip (CPCI-S收录) 会议论文
18TH IEEE INTERNATIONAL SYMPOSIUM ON DEFECT AND FAULT TOLERANCE IN VLSI SYSTEMS, PROCEEDINGS
作者:  Zhao, TX;  Duan, XC
收藏  |  浏览/下载:0/0  |  提交时间:2019/04/19


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