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长程面形仪稳定系统的设计 期刊论文
北京理工大学学报, 2018, 卷号: 38, 期号: 10, 页码: 1085-1090 and 1095
作者:  汤善治;  Li, Ming;  Tang, Shan-Zhi;  Yang, Fu-Gui;  李明
收藏  |  浏览/下载:23/0  |  提交时间:2019/10/11
Effects of flux activators and processing parameters on solderability and stability of the aluminum solder paste used for automated assembly (CPCI-S收录) 会议
作者:  Zhang, Lang;  Zhou, Min-Bo;  Qiu, Fu-Shun;  Ma, Xiao;  Zhang, Xin-Ping[1]
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/11
Influence of the solder volume and reflow process on solderability of the aluminum solder paste and reliability of Sn-0.3Ag-0.7Cu/6061Al sold (CPCI-S收录) 会议
作者:  Lin, Yuan-Jiang[1];  Zhou, Min-Bo[1];  Ma, Xiao[1];  Zhang, Xin-Ping[1]
收藏  |  浏览/下载:4/0  |  提交时间:2019/04/11


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