CORC

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CORC

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Continuous recycling of diamond wire sawing silicon powder - electron beam melting coupled with continuous feeding technology 期刊论文
CHEMICAL ENGINEERING JOURNAL, 2024, 卷号: 484, 页码: 16
作者:  Hu, Zhiqiang;  Cui, Yirong;  Li, Jiayan;  Tan, Yi;  Liu, Yao
收藏  |  浏览/下载：0/0  |  提交时间：2024/06/04
Recycling of kerf loss silicon: An optimized method to realize effective elimination of various impurities 期刊论文
WASTE MANAGEMENT, 2023, 卷号: 170, 页码: 230-239
作者:  Hu, Zhiqiang;  Yuan, Fangyuan;  Li, Jiayan;  Tan, Yi;  Liu, Yao
收藏  |  浏览/下载：5/0  |  提交时间：2023/11/30
Recycling of diamond-wire sawing silicon powder by direct current assisted directional solidification 期刊论文
WASTE MANAGEMENT, 2023, 卷号: 157, 页码: 190-198
作者:  Hu, Zhiqiang;  Wang, Guoliang;  Li, Jiayan;  Tan, Yi;  Liu, Yao
收藏  |  浏览/下载：17/0  |  提交时间：2023/02/01
Silicon recovery from silicon sawing waste by removal of SiC impurity via CaO-SiO2-Na2O slag absorption 期刊论文
SEPARATION AND PURIFICATION TECHNOLOGY, 2020, 卷号: 231, 页码: 7
作者:  Wang, Dong;  Wang, Zhankui;  Wang, Zhi;  Qian, Guoyu;  Gong, Xuzhong
收藏  |  浏览/下载：98/0  |  提交时间：2019/11/12
The effect of cut depth and distribution for abrasives on wafer surface morphology in diamond wire sawing of PV polycrystalline silicon 期刊论文
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2019, 卷号: 91, 页码: 316-326
作者:  Li, Xinying;  Gao, Yufei;  Ge, Peiqi;  Zhang, Lei;  Bi, Wenbo
收藏  |  浏览/下载：16/0  |  提交时间：2019/12/11
Material removal and surface generation mechanisms in diamond wire sawing of silicon crystal 期刊论文
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2019, 卷号: 103
作者:  Gao, Yufei;  Ge, Peiqi;  Zhang, Lei;  Bi, Wenbo
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/11
Sawing stress of SiC single crystal with void defect in diamond wire saw slicing 期刊论文
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2019, 卷号: 103, 期号: 1-4, 页码: 1019-1031
作者:  Gao, Yufei;  Chen, Yang
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/11
Experimental study on surface topography and fracture strength of worn saw wire in multi-wire sawing 期刊论文
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2017, 卷号: 93, 页码: 4125-4132
作者:  Li, Zhen;  Wang, Minjie;  Cai, Yujun;  Jia, Haili
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03
Prediction of subsurface damage of endless diamond wire sawing YAG crystal 期刊论文
Jingangshi yu Moliao Moju Gongcheng/Diamond and Abrasives Engineering, 2017, 卷号: 37
作者:  Liu, Wentao;  Zhao, Huiying;  Li, Bin;  Zhao, Lingyu;  Yu, Hechun
收藏  |  浏览/下载：5/0  |  提交时间：2019/11/26
Effect of wire speed on subsurface cracks in wire sawing process of single crystal silicon carbide 期刊论文
ENGINEERING FRACTURE MECHANICS, 2017, 卷号: 184, 页码: 273-285
作者:  Wang, Peizhi;  Ge, Peiqi;  Bi, Wenbo;  Ge, Mengran;  Liu, Tengyun
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/12

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