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CORC

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Non-tensile piezoresistive sensor based on coaxial fiber with magnetoactive shell and conductive flax core 期刊论文
Composites Part A: Applied Science and Manufacturing, 2021, 卷号: 149
作者:  Q. Shu;  T. Hu;  Z. Xu;  J. Zhang;  X. Fan
收藏  |  浏览/下载：11/0  |  提交时间：2022/06/13
Droplet formation study of a liquid micro-dispenser driven by a piezoelectric actuator 期刊论文
SMART MATERIALS AND STRUCTURES, 2019, 卷号: 28, 期号: 5
作者:  Lu, Shizhou;  Zhang, Jiexin;  Liu, Yong;  Zheng, Hai;  Ren, Chenliang
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/11
Toward Biobased, Biodegradable, and Smart Barrier Packaging Material: Modification of Poly(Neopentyl Glycol 2,5-Furandicarboxylate) with Succinic Acid 期刊论文
ACS SUSTAINABLE CHEMISTRY & ENGINEERING, 2019, 卷号: 7, 期号: 4, 页码: 4255-4265
作者:  Hu, Han;  Zhang, Ruoyu;  Jiang, Yanhua;  Shi, Lei;  Wang, Jinggang
收藏  |  浏览/下载：21/0  |  提交时间：2019/12/18
Verifiable Smart Packaging with Passive RFID 期刊论文
IEEE Transactions on Mobile Computing, 2018
作者:  WANG, GE;  Han, Jinsong;  Qian, Chen;  Xi, Wei;  Ding, Han
收藏  |  浏览/下载：13/0  |  提交时间：2019/11/26
Highly Thermally Conductive and Light Weight Copper/Graphene Film Laminated composites for Cooling Applications 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Wang, Nan[1];  Chen, Shujing[2];  Nkansah, Amos[3];  Darmawan, Christian Chandra[4];  Ye, Lilei[5]
收藏  |  浏览/下载：13/0  |  提交时间：2019/04/22
The influence of sintering process on thermal properties of nano-silver paste 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Lu, Xiuzhen[1];  Zhang, Qianran[2];  Zehri, Abdelhafid[3];  Ke, Wei[4];  Huang, Shirong[5]
收藏  |  浏览/下载：15/0  |  提交时间：2019/04/22
Reliability study on high thermally conductive graphene film as heat spreader in electronics cooling applications 会议论文
2018 IMAPS Nordic Conference on Microelectronics Packaging, NORDPAC 2018, 2018-06-12
作者:  Nkansah, Amos[1];  Wang, Nan[2];  Ye, Lilei[3];  Wang, Xitao[4];  Liu, Johan[5]
收藏  |  浏览/下载：5/0  |  提交时间：2019/04/22
Recent advances in wearable tactile sensors: Materials, sensing mechanisms, and device performance 期刊论文
MATERIALS SCIENCE & ENGINEERING R-REPORTS, 2017
Yang, Tingting; Xie, Dan; Li, Zhihong; Zhu, Hongwei
收藏  |  浏览/下载：28/0  |  提交时间：2017/12/03
Improved Reliability of Electrically Conductive Adhesives Joints on Cu-Plated PCB Substrate Enhanced by Graphene Protection Barrier 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Huang, Shirong[1];  Ke, Wei[2];  Yang, Yiqun[3];  Ye, Hui[4];  Chen, Shujing[5]
收藏  |  浏览/下载：41/0  |  提交时间：2019/04/24
Finite Element Analysis of Bond Line Thickness and Fiber Distribution in Solder Based Thermal Interface Materials 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Satwara, Maulik[1];  Hansson, Josef[2];  Ye, Lilei[3];  Rhedin, Henric[4];  Liu, Johan[5]
收藏  |  浏览/下载：4/0  |  提交时间：2019/04/24

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