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浏览/检索结果: 共5条，第1-5条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Material removal and surface generation mechanisms in diamond wire sawing of silicon crystal 期刊论文 MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2019, 卷号: 103 作者:  Gao, Yufei;  Ge, Peiqi;  Zhang, Lei;  Bi, Wenbo 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/11 Silicon crystal  Wire sawing  Material removal  Surface generation   Comparison of wear performance of diamond tools in frame sawing with different trajectories 期刊论文 INTERNATIONAL JOURNAL OF REFRACTORY METALS & HARD MATERIALS, 2019, 卷号: 78, 页码: 178-185 作者:  Zhang, Heng;  Zhang, Jinsheng;  Wang, Shuo 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/11 Diamond tools  Sawing trajectories  Sawing mechanisms  Matrix tail  Segment wear   Microstructure and densification mechanism of Fe-Cu based diamond composite ultra thin sawing matrixes at different cold pressures 期刊论文 Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, 2013, 卷号: 23, 期号: 6, 页码: 1523-1529 作者:  Li, Wen-Sheng;  Dong, Hong-Feng;  Lu, Yang;  Zhang, Jie;  Chu, Ke 收藏  |  浏览/下载：14/0  |  提交时间：2020/11/14 Binary alloys  Compaction  Copper alloys  Densification  Diamonds  Friction  Microhardness  Microstructure  Powders  Sawing  Archimedes principle  Cu-based matrix  Densification mechanisms  Diamond composites  Microhardness tester  Non-uniform deformation  Ultra-thin  Uniaxial compaction   Densification mechanism of Cu-Fe based diamond composite ultra thin sawing matrixes during cold uniaxial compaction 期刊论文 Fenmo Yejin Cailiao Kexue yu Gongcheng/Materials Science and Engineering of Powder Metallurgy, 2013, 卷号: 18, 期号: 3, 页码: 326-332 作者:  Dong, Hong-Feng;  Li, Wen-Sheng;  Lu, Yang;  Zhang, Jie;  Wang, Jun-Wei 收藏  |  浏览/下载：16/0  |  提交时间：2020/11/14 Aspect ratio  Compaction  Densification  Diamonds  Microhardness  Microstructure  Sawing  Strain hardening  Archimedes principle  Densification mechanisms  Different pressures  Experimental values  Microhardness tester  Non-uniform deformation  Ultra-thin  Uniaxial compaction   Unusual defects, generated by wafer sawing: Diagnosis, mechanisms and how to distinguish from related failures. 期刊论文 Microelectronics and Reliability, 2008, 卷号: Vol.48 No.8-9, 页码: 1253-1257 作者:  Rothkirch,Werner;  Jacob,Peter 收藏  |  浏览/下载：1/0  |  提交时间：2020/01/13 SEMICONDUCTOR  wafers  MICROELECTRONICS  ELECTRONICS  INFORMATION  technology