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A Module-Based Self-Balancing Series Connection for IGBTs 期刊论文
IEEE Transactions on Industrial Electronics, 2020
作者:  Yang L(杨雷)
收藏  |  浏览/下载:71/0  |  提交时间:2020/10/20
The Development of Power Supply for Negative Ion Source Extraction Grid 期刊论文
IEEE TRANSACTIONS ON PLASMA SCIENCE, 2018, 卷号: 46, 期号: 5, 页码: 1699-1703
作者:  Hu, Chun-Dong;  Huang, Mei-Chu;  Jiang, Cai-Chao;  Xie, Ya-Hong;  Wei, Jiang-Long
收藏  |  浏览/下载:2/0  |  提交时间:2019/06/10
New Energy Empowerment Using Kernel Principal Component Analysis in Insulated Gate Bipolar Transistors Module Monitoring 期刊论文
SUSTAINABILITY, 2018, 卷号: 10
作者:  Liu, Bo-Ying;  Wang, Gao-Sheng;  Tseng, Ming-Lang;  Li, Zhi-Gang;  Wu, Kuo-Jui
收藏  |  浏览/下载:4/0  |  提交时间:2019/12/02
Experimental Investigation on the Effects of Narrow Junction Temperature Cycles on Die-Attach Solder Layer in an IGBT Module (EI收录) 期刊论文
IEEE Transactions on Power Electronics, 2017, 卷号: 32, 页码: 1431-1441
作者:  Lai, Wei[1];  Chen, Minyou[1];  Ran, Li[2];  Xu, Shengyou[1];  Jiang, Nan[1]
收藏  |  浏览/下载:13/0  |  提交时间:2019/04/24
Using Failure Analysis Techniques to Identify Key Information of PHM 会议论文
2015 PROGNOSTICS AND SYSTEM HEALTH MANAGEMENT CONFERENCE (PHM), 2015-01-01
作者:  Jiang, Maogong;  Fu, Guicui;  Wang, Danyan;  Zhang, Dong
收藏  |  浏览/下载:2/0  |  提交时间:2020/01/06


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