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Influence of Ni and Cu electrodeposits on the interfacial reaction between SAC305 solder and the Bi2(Te,Se)3 thermoelectric material 期刊论文
Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 15, 页码: 14791-14804
作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin
收藏  |  浏览/下载:0/0  |  提交时间:2020/11/14
Influence of Ni and Cu electrodeposits on the interfacial reaction between SAC305 solder and the Bi-2(Te,Se)(3) thermoelectric material 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 15, 页码: 14791-14804
作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin
收藏  |  浏览/下载:7/0  |  提交时间:2019/11/15
Electrodeposition in the Ni-plating bath containing multi-walled carbon nanotubes 期刊论文
Materials Chemistry and Physics, 2008, 卷号: 110, 期号: 2-3, 页码: 481-485
B. G. An; L. X. Li; H. X. Li
收藏  |  浏览/下载:11/0  |  提交时间:2012/04/13
铜、钴及铜钴合金的电结晶及Co/Cu多层膜的电化学制备 学位论文
2008, 2003
辜敏
收藏  |  浏览/下载:2/0  |  提交时间:2016/02/14
(110)晶面全择优取向Cu镀层的制备及其条件优化 The Preparation of Copper Electrodeposits with (110) Lattice Plane Fully Preferred Orientation 期刊论文
2006, 卷号: 22, 页码: 378-382
作者:  辜敏[1];  鲜晓红[2]
收藏  |  浏览/下载:1/0  |  提交时间:2019/11/28
The formation of copper electrodeposits with highly preferred orientation and their surface morphology 期刊论文
2002
Gu, M; 辜敏; Yang, FZ; 杨防祖; Huang, L; 黄令; Yao, SB; 姚士冰; Zhou, SM; 周绍民
收藏  |  浏览/下载:1/0  |  提交时间:2012/05/06
电沉积多晶CuInSe_2薄膜的光电化学——Ⅰ.CuInSe_2薄膜的电沉积 期刊论文
中国科学B辑, 1991, 期号: 6, 页码: 583-589
王江山; 谭正; 糜天英; 孙公权
收藏  |  浏览/下载:23/0  |  提交时间:2011/03/03


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