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Development of Pulsar Digital Backend Based on RFSoC
期刊论文
RESEARCH IN ASTRONOMY AND ASTROPHYSICS, 2022, 卷号: 22, 期号: 2, 页码: 13
作者:
Ergesh, Toktonur
;
Li, Jian
;
Duan, Xue-Feng
;
Pei, Xin
;
Wen, Zhi-Gang
收藏
  |  
浏览/下载:27/0
  |  
提交时间:2022/03/21
astronomical instrumentation
astronomical techniques
radio astronomy
Design and implementation of plasma electron density measurements based on FPGA with all-phase FFT for tokamak devices
期刊论文
REVIEW OF SCIENTIFIC INSTRUMENTS, 2021, 卷号: 92
作者:
Shu, Shuangbao
;
Lai, Jin
;
Chen, Zhiqiang
;
Wang, Yong
;
Zhang, Yuzhong
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  |  
浏览/下载:24/0
  |  
提交时间:2022/01/10
A Chip-Level Optical Interconnect for CPU
期刊论文
IEEE PHOTONICS TECHNOLOGY LETTERS, 2021, 卷号: 33, 期号: 16, 页码: 852-855
作者:
Hao, Qinfen
;
Qin, Mengyuan
;
Qi, Nan
;
Xue, Haiyun
;
Han, Meng
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  |  
浏览/下载:48/0
  |  
提交时间:2021/12/01
Integrated optics
Optical interconnections
Transceivers
Adaptive optics
Optical switches
Optical sensors
Power demand
Optical interconnections
digital integrated circuits
very high speed integrated circuits
chip scale packaging
system integration
Accelerated damage and deterioration mechanism of concrete in saline soil area and reliability analysis based on Wiener process
期刊论文
Zhongguo Kuangye Daxue Xuebao/Journal of China University of Mining and Technology, 2021, 卷号: 50, 期号: 2, 页码: 265-272
作者:
Lu, Chenggong
;
Qiao, Hongxia
;
Wei, Zhiqiang
;
Li, Kan
;
Fu, Yong
收藏
  |  
浏览/下载:14/0
  |  
提交时间:2022/02/17
Compressive strength
Concretes
Cracks
Crystals
Deterioration
Durability
Dynamics
Elastic moduli
Erosion
Expansion
Freezing
Petroleum reservoir evaluation
Quality control
Random processes
Soils
Stochastic systems
Thawing
Underground corrosion
Degree of reliability
Deterioration mechanism
Dynamic elastic moduli
Evaluation parameters
Macroscopic evaluation indexes
Microscopic evaluation
Multiple damage factors
Reliability degradation
Efficient Bond of PDMS and Printed Circuit Board with An Application on Continuous-flow Polymerase Chain Reaction
期刊论文
BIOCHIP JOURNAL, 2020, 卷号: 14
作者:
Chang, Yongjia
;
You, Hui
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  |  
浏览/下载:52/0
  |  
提交时间:2020/12/28
Microfluidics
PDMS
PCB
Continuous-flow PCR
Bonding
The design and realization of intelligent greenhouse control system based on cloud integration
会议论文
Guiyang, China, August 14, 2020 - August 15, 2020
作者:
Zhao, Hong
;
Kong, Dongyi
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  |  
浏览/下载:13/0
  |  
提交时间:2020/12/18
Control systems
Data acquisition
Information systems
Information use
Integration
Management information systemsActuator control
Bus communications
Cloud integrations
Cloud platforms
Control boards
Greenhouse management
Intelligent greenhouse
Publication mechanisms
A scalable High Voltage Power Supply System with system on chip control for Micro Pattern Gaseous Detectors
期刊论文
NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT, 2020, 卷号: 963, 页码: 13
作者:
Carrato, S.
;
Chatterjee, C.
;
Cicuttin, A.
;
Ciliberti, P.
;
Crespo, M. L.
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  |  
浏览/下载:24/0
  |  
提交时间:2022/01/18
High Voltage
MPGD
SoC
FPGA
DC to DC converter
The Medium Energy X-ray telescope (ME) onboard the Insight-HXMT astronomy satellite
期刊论文
SCIENCE CHINA-PHYSICS MECHANICS & ASTRONOMY, 2020, 卷号: 63, 期号: 4, 页码: 249504
作者:
Cao, XueLei
;
Jiang, WeiChun
;
Meng, Bin
;
Zhang, WanChang
;
Luo, Tao
收藏
  |  
浏览/下载:31/0
  |  
提交时间:2020/10/19
dSi-PIN
ASIC
medium energy X-ray
Ultrathin and Flexible Reflective Polarization Converter Based on Metasurfaces With Overlapped Arrays
期刊论文
IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS, 2020, 卷号: 19, 期号: 12, 页码: 2512-2516
作者:
Wang YL(汪业龙)
;
Qi F(祁峰)
;
Liu ZY(刘朝阳)
;
Liu PX(刘鹏翔)
;
Li WF(李惟帆)
收藏
  |  
浏览/下载:25/0
  |  
提交时间:2021/01/22
Substrates
Copper
Reflection coefficient
Reflection
Surface waves
Resonant frequency
Current density
Conformal metasurface
overlapped array
reflective polarization converter
ultrathin
Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder
期刊论文
ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614
作者:
Cao Lihua
;
Chen Yinbo
;
Shi Qiyuan
;
Yuan Jie
;
Liu Zhiquan
收藏
  |  
浏览/下载:129/0
  |  
提交时间:2021/02/02
alloy element
Sn-Ag-Cu solder
intermetallic compound
interfacial morphology
shear strength
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