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Study on Signal Enhancement Technology for Atomic Fluorescence Spectrometry Based on Digital Micromirror Device
期刊论文
Chinese Journal of Analytical Chemistry, 2021, 卷号: 49, 期号: 9
作者:
H. X. Wang
;
Y. C. Li
;
C. S. Li
;
Z. H. Zhou
;
Z. Y. Ma and D. Tian
收藏
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浏览/下载:5/0
  |  
提交时间:2022/06/13
Effects of the Ni electrodeposit on microstructure evolution and electrical resistance of the P-type Bi2Te3 solder joint
期刊论文
Journal of Alloys and Compounds, 2020, 卷号: 832
作者:
Cheng, Jinxuan
;
Hu, Xiaowu
;
Li, Qinglin
收藏
  |  
浏览/下载:21/0
  |  
提交时间:2020/11/14
Bismuth compounds
Diffusion
Electric resistance
Electrodes
Growth rate
IV-VI semiconductors
Microstructure
Scanning electron microscopy
Tin
Tin compounds
Transmission electron microscopy
Diffusion process
Electrical resistances
Micro-structure evolutions
Porous structures
Thermodynamically stable
Thermoelectric
Volume diffusion
X ray diffractometers
Production mechanism of proton-rich actinide isotopes in fusion reactions and via multinucleon transfer processes
期刊论文
PHYSICAL REVIEW C, 2020, 卷号: 102, 期号: 1, 页码: 13
作者:
Chen, Peng-Hui
;
Niu, Fei
;
Feng, Zhao-Qing
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  |  
浏览/下载:12/0
  |  
提交时间:2022/01/12
Geochemistry of sulfide minerals from skarn Cu (Au) deposits in the Fenghuangshan ore field, Tongling, eastern China: Insights into ore-forming process
期刊论文
ORE GEOLOGY REVIEWS, 2020, 卷号: 122, 页码: 18
作者:
Xie, Jiancheng
;
Tang, Dawei
;
Qian, Lin
;
Wang, Yu
;
Sun, Weidong
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  |  
浏览/下载:26/0
  |  
提交时间:2020/09/25
Geochemistry
Pyrite
Chalcopyrite
Skarn deposit
Tongling region
Effects of the Ni(P) plating thickness on microstructure evolution of interfacial IMCs in Sn–58Bi/Ni(P)/Cu solder joints
期刊论文
Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 14, 页码: 11470-11481
作者:
Cheng, Jinxuan
;
Hu, Xiaowu
;
Zhang, Zhe
;
Li, Qinglin
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2020/11/14
Binary alloys
Diffusion
Growth rate
Soldering
Atomic diffusions
Compound layer
Diffusion channels
Diffusion process
Micro-structure evolutions
Plating thickness
Solder joint reliability
Solder joints
Effect of Co addition into Ni film on shear strength of solder/Ni/Cu system: Experimental and theoretical investigations
期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2020, 卷号: 788
作者:
Bi, Xiaoyang
;
Hu, Xiaowu
;
Li, Qinglin
收藏
  |  
浏览/下载:16/0
  |  
提交时间:2022/03/01
Solder joints
Ni-Co film
Shear strength
Atomic model
Intermetallic compound
First-principles calculations
Influences of Ni addition into Cu–xNi alloy on the microstructure evolution and mechanical property of Sn–58Bi/Cu–xNi solder joint
期刊论文
Applied Physics A: Materials Science and Processing, 2020, 卷号: 126, 期号: 4
作者:
Cheng, Jinxuan
;
Hu, Xiaowu
;
Li, Qinglin
;
Jiang, Xiongxin
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2020/11/14
Ductile fracture
Microstructure
Soldering
Fracture mechanisms
IMC layer
Liquid-state reaction
Micro-structure evolutions
Ni additions
Reflow--soldering
Solder joints
Synergistic effect
Wetting of Cu and Cu-Sn IMCs by Sn-Bi Alloys over Wide Composition at 350°C
期刊论文
Journal of Electronic Materials, 2019, 卷号: 48, 期号: 7, 页码: 4660-4668
作者:
Sui, Ran
;
Li, Fuxiang
;
Ci, Wenjuan
;
Lin, Qiaoli
收藏
  |  
浏览/下载:1/0
  |  
提交时间:2020/11/14
Bismuth alloys
Copper
Copper oxides
Joining
Oxide films
Phase interfaces
Soldering
Ternary alloys
Tin compounds
Wetting
Cu intermetallics
IMC layer
Interfacial reactivity
Interfacial structures
Sessile drop method
Sn-Bi alloy
Spreading characteristics
Ternary phase diagrams
Synergistic Effect of Bismuth and Indium Codoping for High Thermoelectric Performance of Melt Spinning SnTe Alloys
期刊论文
ACS APPLIED MATERIALS & INTERFACES, 2019, 卷号: 11, 期号: 26, 页码: 23337-23345
作者:
Tang, Huan
;
Guo, Lijie
;
Wang, Guiwen
;
Wu, Hong
;
Shen, Xingchen
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  |  
浏览/下载:62/0
  |  
提交时间:2019/12/03
SnTe
melt spinning
thermal conductivity
resonant level
thermoelectric
Wetting of Cu and Cu-Sn IMCs by Sn-Bi Alloys over Wide Composition at 350 degrees C
期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2019, 卷号: 48, 期号: 7, 页码: 4660-4668
作者:
Sui, Ran
;
Li, Fuxiang
;
Ci, Wenjuan
;
Lin, Qiaoli
收藏
  |  
浏览/下载:7/0
  |  
提交时间:2019/11/15
Wettability
soldering
joining
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