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浏览/检索结果: 共9条，第1-9条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Research on Probabilistic Failure Physical Model of BGA Solder Joints in Multiple Fields Coupling 会议论文 2018 PROGNOSTICS AND SYSTEM HEALTH MANAGEMENT CONFERENCE (PHM-CHONGQING 2018), 2018-01-01 作者:  Li, Sufen;  Sun, Yufeng;  Li, Xiaoxiao 收藏  |  浏览/下载：15/0  |  提交时间：2019/12/30 BGA solder joint  creep damage model  fatigue damage model  coupling failure physical model  probabilistic failure physical model   Study on the cumulative rule of vibration damage of BGA solder joint under multi-phase condition 会议论文 12TH INTERNATIONAL CONFERENCE ON RELIABILITY, MAINTAINABILITY, AND SAFETY (ICRMS 2018), 2018-01-01 作者:  Ma Qichao;  Chen Ying 收藏  |  浏览/下载：64/0  |  提交时间：2019/12/30 Vibration Fatigue  Life Prediction  Damage Accumulation  Finite Element Simulation   Research on BGA Solder Joint Two-dimensional Quality Information Extraction 会议论文 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, PEOPLES R CHINA, AUG 13-16, 2012 作者:  Zhao Huihuang*;  Wang Yaonan;  Sun Yaqi 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/24 Microstructural evolution and cracking of Pb-free ball grid array assemblies under thermal cycling 期刊论文 Journal of Materials Science & Technology, 2007, 卷号: 23, 期号: 1, 页码: 85-91 W. Wang; Z. G. Wang; A. P. Xian; J. K. Shang 收藏  |  浏览/下载：12/0  |  提交时间：2012/04/13 CBGA  thermal cycling  FEM  assembly  cracking  solder joint reliability  level reliability  flex-substrate  interconnect  snagcu  bga  segregation  packages  behavior  bismuth   Interfacial reactions and formation of inter metallic compound of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu joints in flip-chip on BGA packaging (CPCI-S收录) 会议 作者:  Huang, Jia-Qiang[1];  Zhou, Min-Bo[1];  Li, Wang-Yun[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 lead-free solder joint  interfacial reaction  microstructure  BGA  differential scanning calorimetry   Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (CPCI-S收录) 会议 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Li, Wang-Yun[1,2];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：10/0  |  提交时间：2019/04/11 BGA solder joint  size effect  lead-free solder  interfacial reaction  microstructure   Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (CPCI-S收录) 会议 作者:  Huang, Lia-Qiang[1,2];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/11 Sn58Bi  Sn3.0Ag0.5Cu  Mixed solder joint  Microstructure  interfacial reaction  Ball grid array   Research on BGA Solder Joint Two-dimensional Quality Information Extraction 会议论文 2012电子封装和高密度封装国际会议(ICEPT-HDP2012), 桂林, 2012 作者:  Zhao Huihuang;  Wang Yaonan;  Sun Yaqi 收藏  |  浏览/下载：1/0  |  提交时间：2020/01/05 Research on BGA Solder Joint Two-dimensional Quality Information Extraction 会议论文 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 1285-1287, 2012 作者:  Zhao, HH;  Wang, YA;  Sun, YQ 收藏  |  浏览/下载：0/0  |  提交时间：2020/01/05