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Microporous corrosion behavior of gold-plated printed circuit boards in an atmospheric environment with high salinity 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 11, 页码: 8877-8885
作者:  Li, Xiaogang;  Xiong, Ruilin;  Hu, Yuting;  Wu, Junsheng;  Dong, Chaofang
收藏  |  浏览/下载:130/0  |  提交时间:2018/12/04
Microporous corrosion behavior of gold-plated printed circuit boards in an atmospheric environment with high salinity 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 11, 页码: 8877-8885
作者:  Li, Xiaogang;  Xiong, Ruilin;  Hu, Yuting;  Wu, Junsheng;  Dong, Chaofang
收藏  |  浏览/下载:133/0  |  提交时间:2018/12/04
Interface defect generation probed by low voltage stress induced leakage current 期刊论文
THIN SOLID FILMS, 2006, 卷号: 504, 期号: 1-2, 页码: 307-311
Yu,YJ; Guo,Q; Zeng,X; Li,H; Liu,SH; Zou,SC
收藏  |  浏览/下载:12/0  |  提交时间:2012/03/24


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