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Mechanical behaviour of sintered silver nanoparticles reinforced by SiC microparticles 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 744, 页码: 406-414
作者:  Long, Xu[1];  Li, Zhen[2];  Lu, Xiuzhen[3];  Guo, Hongcun[4];  Chang, Chao[5]
收藏  |  浏览/下载:49/0  |  提交时间:2019/04/22
The influence of sintering process on thermal properties of nano-silver paste 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Lu, Xiuzhen[1];  Zhang, Qianran[2];  Zehri, Abdelhafid[3];  Ke, Wei[4];  Huang, Shirong[5]
收藏  |  浏览/下载:15/0  |  提交时间:2019/04/22
Improved Reliability of Electrically Conductive Adhesives Joints on Cu-Plated PCB Substrate Enhanced by Graphene Protection Barrier 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Huang, Shirong[1];  Ke, Wei[2];  Yang, Yiqun[3];  Ye, Hui[4];  Chen, Shujing[5]
收藏  |  浏览/下载:41/0  |  提交时间:2019/04/24
Effect of sintering method on properties of nanosilver paste 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Zhang, Qiaoran[1];  Liu, Jiawen[2];  Ke, Wei[3];  Huang, Shirong[4];  Latorre, Marti Gutierrez[5]
收藏  |  浏览/下载:16/0  |  提交时间:2019/04/24
Heat Dissipation Performance of Graphene Enhanced Electrically Conductive Adhesive for Electronic Packaging 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Yang, Yiqun[1];  Ye, Hui[2];  Ke, Wei[3];  Huang, Shirong[4];  Wang, Nan[5]
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/24
A high-efficiency real-time digital signal averager for time-of-flight mass spectrometry 期刊论文
RAPID COMMUNICATIONS IN MASS SPECTROMETRY, 2013, 卷号: 27, 页码: 1155-1167
作者:  Wang, Yinan[1];  Xu, Hui[2];  Li, Qingjiang[3];  Li, Nan[4];  Huang, Zhengxu[5]
收藏  |  浏览/下载:3/0  |  提交时间:2019/04/30


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