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浏览/检索结果: 共6条，第1-6条 帮助 限定条件 专题：华南理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Electrical conductivity investigation of a nonwoven fabric composed of carbon fibers and polypropylene/polyethylene core/sheath bicomponent fibers (EI收录) 期刊论文 Materials and Design, 2016, 卷号: 112, 页码: 383-391 作者:  Lu, Longsheng[1,2];  Xing, Di[1];  Xie, Yingxi[1,2];  Teh, Kwok Siong[2,3];  Zhang, Bin[1] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/24 Carbon fibers  Electric conductivity  Electromagnetic pulse  Electromagnetic shielding  Fabrics  Fibers  Nonwoven fabrics  Percolation (computer storage)  Percolation (fluids)  Polypropylenes  Scanning electron microscopy  Solvents  Tensile strength   Measurement of full-field ductile damage based on resistance Method (EI收录) 会议论文 Procedia Engineering, Nagoya, Japan, October 19, 2014 - October 24, 2014 作者:  Saijun, Zhang[1];  Chi, Zhou[1];  Qinxiang, Xia[1];  Songmao, Chen[1] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/12 Image analysis  Strain measurement   Mechanical Behaviors and Thermoforming Features of PMMA Used In-mold Decoration (CPCI-S收录) 会议论文 FRONTIERS OF MANUFACTURING AND DESIGN SCIENCE IV, PTS 1-5 作者:  Chen, Songmao[1];  Zhang, Saijun[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/12 In-mold decoration  Thermoforming  Strain softening  Strain hardening   Measurement of full-field ductile damage based on resistance method (CPCI-S收录) 会议论文 11TH INTERNATIONAL CONFERENCE ON TECHNOLOGY OF PLASTICITY, ICTP 2014 作者:  Zhang Saijun[1];  Zhou Chi[1];  Xia Qinxiang[1];  Chen Songmao[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/12 Damage measurement  Ductile damage  Full-field  Digital image correlation  Electrical resistance method   Numerical simulation of the pre-drawing and air-bulging thermoforming process for in-mould decoration films (CPCI-S收录EI收录) 会议论文 Journal of Computational and Theoretical Nanoscience 作者:  Chen, Songmao[1];  Zhang, Saijun[1];  Ruan, Feng[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 Computer simulation  Finite element method  Molds   A material subroutine for numerical simulation of thermoforming of IMD films (EI收录) 会议论文 2010 International Conference on Mechanic Automation and Control Engineering, MACE2010, Wuhan, China, June 26, 2010 - June 28, 2010 作者:  Chen, Songmao[1];  Zhang, Saijun[1];  Ruan, Feng[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/16 Computer simulation  Decision theory  Mechanics  Molds  Subroutines  Thermoforming