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浏览/检索结果: 共13条，第1-10条 帮助 限定条件 专题：华南理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Insights into the mechanism of persulfate activation with nZVI/BC nanocomposite for the degradation of nonylphenol (EI收录) 期刊论文 Chemical Engineering Journal, 2017, 卷号: 311, 页码: 163-172 作者:  Hussain, Imtyaz[1,2,3];  Li, Mingyu[1,2];  Zhang, Yongqing[3,4,5];  Li, Yichun[1,2];  Huang, Shaobin[3,4,5] 收藏  |  浏览/下载：118/0  |  提交时间：2019/04/24 Chemical activation  Degradation  Electron spin resonance spectroscopy  Endocrine disrupters  Fourier transform infrared spectroscopy  Iron  Magnetic resonance  Neptunium  Paramagnetic resonance  Phenols  Scanning electron microscopy  Wastewater treatment  X ray diffraction   Automatic Windowing for Highly Dynamic Industrial X-ray Image Based on Short-Term Energy of Gray Histogram (EI收录) 期刊论文 Journal of Nondestructive Evaluation, 2017, 卷号: 36 作者:  Tan, Fenglin[1];  Li, Yanxiong[2];  Guan, Mingyu[2] 收藏  |  浏览/下载：7/0  |  提交时间：2019/04/24 Image segmentation  X ray analysis   Comparison of bond interface reaction in Al-Ni and Al-Au systems formed by utrasonic wedge bonding (CPCI-S收录) 会议论文 2006 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, VOLS 1-3 作者:  Li, Mingyu[1];  Ji, Hongjun[2];  Wang, Chunqing[2] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/18 Evolution of AuSnx intermetallic components in laser reflowed right-angled solder joints during isothermal aging process (CPCI-S收录) 会议论文 ICEPT: 2006 7TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS 作者:  Wei, Liu[1];  Wang Chunqing[1];  Tian Yanhong[1];  Li Mingyu[2] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/18 Observation of ultrasonic Al-Si wire wedge bond interface using high resolution transmission electron microscope (CPCI-S收录) 会议论文 ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS 作者:  Ji, Hongjun[1];  Li, Mingyu[1];  Kweon, Younggak[2];  Chang, Woongseong[2] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/17 The low temperature exothermic sintering of formic acid treated Cu nanoparticles for conductive ink (CPCI-S收录) 会议 作者:  Liu, Jingdong[1];  Ji, Hongjun[1];  Wang, Shuai[2];  Li, Mingyu[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/11 Abnormal Grain Growth in Cu6Sn5 Grains Formed at Sn-based Solder/Cu Interfaces (CPCI-S收录) 会议论文 2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:  Yang, Ming[1];  Li, Mingyu[1];  Wu, Jianxin[2];  Xu, Jinhua[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/12 lead-free solders  abnormal growth  diffusion  IMC   Ultrasound-assisted brazing of large area Cu/Al dissimilar metals used for package heat dissipation substrate (CPCI-S收录) 会议论文 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:  Xiao, Yong[1];  Li, Mingyu[1];  Kim, Jongmyung[2] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/15 Cu-Al brazing  Zn-Al alloy  ultrasonic vibration  microstructure  tensile strength  corrosion resistance   Pressureless Low Temperature Sintering of Ag Nanoparticles for Interconnects (CPCI-S收录) 会议论文 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING (EMAP 2012) 作者:  Wang, Shuai[1];  Ji, Hongjun[1];  Li, Mingyu[1];  Kim, Jongmyung;  Kim, Hongbae[2] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 Epitaxial growth of intermetallic compounds formed at eutectic Sn37Pb/polycrystalline Cu interface during solid-state aging (CPCI-S收录) 会议论文 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:  Yang, Ming[1];  Li, Mingyu[1];  Ma, Xin[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 Cu6Sn5  orientation evolution  microstructure  EBSD  diffusion