CORC

在结果中检索

CORC

浏览/检索结果: 共24条，第1-10条 帮助

限定条件                
已选(0)清除 条数/页：   排序方式：
Nucleation location and propagation direction of radial and median cracks for brittle material in scratching 期刊论文
CERAMICS INTERNATIONAL, 2019, 卷号: 45, 期号: 6, 页码: 7524-7536
作者:  Li, Xinying;  Gao, Yufei;  Ge, Peiqi;  Zhang, Lei;  Bi, Wenbo
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/11
The effect of cut depth and distribution for abrasives on wafer surface morphology in diamond wire sawing of PV polycrystalline silicon 期刊论文
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2019, 卷号: 91, 页码: 316-326
作者:  Li, Xinying;  Gao, Yufei;  Ge, Peiqi;  Zhang, Lei;  Bi, Wenbo
收藏  |  浏览/下载：16/0  |  提交时间：2019/12/11
Material removal and surface generation mechanisms in diamond wire sawing of silicon crystal 期刊论文
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2019, 卷号: 103
作者:  Gao, Yufei;  Ge, Peiqi;  Zhang, Lei;  Bi, Wenbo
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/11
Sawing stress of SiC single crystal with void defect in diamond wire saw slicing 期刊论文
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2019, 卷号: 103, 期号: 1-4, 页码: 1019-1031
作者:  Gao, Yufei;  Chen, Yang
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/11
Experimental study of rectangular groove texture in the surface of photovoltaic silicon with diamond coated micro-milling tools 期刊论文
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2018, 卷号: 86, 页码: 23-35
作者:  Wu, Yuantai;  Zhang, Lei;  Ge, Peiqi;  Gao, Yufei
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/11
Coupling stress caused by thermal and slicing force in KDP crystal slicing with fixed abrasive wire saw 期刊论文
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2018, 卷号: 96, 期号: 9-12, 页码: 4333-4343
作者:  Li, Zongqiang;  Ge, Peiqi;  Bi, Wenbo;  Liu, Tengyun;  Wang, Peizhi
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/11
Stress analysis in scratching of anisotropic single-crystal silicon carbide 期刊论文
INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, 2018, 卷号: 141, 页码: 1-8
作者:  Wang, Peizhi;  Ge, Peiqi;  Bi, Wenbo;  Liu, Tengyun;  Gao, Yufei
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/11
Study on the subsurface microcrack damage depth in electroplated diamond wire saw slicing SiC crystal 期刊论文
CERAMICS INTERNATIONAL, 2018, 卷号: 44, 期号: 18, 页码: 22927-22934
作者:  Gao, Yufei;  Chen, Yang;  Ge, Peiqi;  Zhang, Lei;  Bi, Wenbo
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/11
Fabrication and performance evaluation for resin-bonded diamond wire saw 期刊论文
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2018, 卷号: 98, 期号: 9-12, 页码: 3269-3277
作者:  Ge, Mengran;  Bi, Wenbo;  Ge, Peiqi;  Gao, Yufei
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/11
A scratching force model of diamond abrasive particles in wire sawing of single crystal SiC 期刊论文
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2017, 卷号: 68, 页码: 21-29
作者:  Wang, Peizhi;  Ge, Peiqi;  Li, Zongqiang;  Ge, Mengran;  Gao, Yufei
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/12

©版权所有 ©2017 CSpace - Powered by CSpace