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浏览/检索结果: 共10条，第1-10条 帮助 限定条件 专题：北京大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 A fast and low computation consumption model for system-level thermal management in 3D IC 其他 2016-01-01 Pi, Yudan; Xu, Wenhua; Jin, Yufeng; Wang, Wei; Wang, Ningyu; Zhang, Jiaxi; Luo, Guojie; Miao, Min 收藏  |  浏览/下载：4/0  |  提交时间：2017/12/03 thermal management  3D IC  low computation   Fabrication and Characterization of Low Stress Si Interposer with Air-gapped Si Interconnection for Hermetical System-in-Package 其他 2016-01-01 Luo, Rongfeng; Ren, Kuili; Ma, Shenglin; Yan, Jun; Xia, Yanming; Jin, Yufeng; Chen, Jing; Wu, Tianzhun; Yang, Hangao; Yuan, Lifang 收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03 Air-gapped Si  Si interposer  low stress  hermetical  System-in-Package  MEMS  WAFER-LEVEL  MEMS RESONATORS  TSV INTERPOSERS  VACUUM  MEMBRANES  DEVICES  SENSORS   Initial thermal stress and strain effects on thermal mechanical stability of through silicon via 期刊论文 MICROELECTRONIC ENGINEERING, 2016 Sun, Yunna; Sun, Shi; Zhang, Yazhou; Luo, Jiangbo; Wang, Yan; Ding, Guifu; Jin, Yufeng 收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03 IC packaging and fabricating  Thermal load  Initial thermal stress and deformation  Thermal mechanical reliability  THROUGH-SILICON  FATIGUE  COPPER  TSV  VIAS   Process Development of a New TGV Interposer for Wafer Level Package of Inertial MEMS Device 其他 2016-01-01 Ma, Shenglin; Ren, Kuili; Xia, Yanming; Yan, Jun; Luo, Rongfeng; Cai, Han; Jin, Yufeng; Ma, Mingjun; Jin, Zhonghe; Chen, Jing 收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03 TGV interposer  Al RDL  Wafer level packaging  Inertial devices   Design and Characterization of Petaloid Hollow Cu Interconnection for Interposer 其他 2016-01-01 Xia, Yanming; Ren, Kuili; Ma, Shenglin; Guan, Yong; Cai, Han; Luo, Rongfeng; Yan, Jun; Chen, Jing; Jin, Yufeng 收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03 petaloid hollow Cu interconnection  3D TSV interposer  thermal-mechanical simulation  influence on electrical property   Process Development of Thick Si Interposer for 2.5D Integration of RF MEMS Devices 其他 2016-01-01 Ren, Kuili; Ma, Shenglin; Ma, Feilong; Yan, Jun; Xia, Yanming; Luo, Rongfeng; Jin, Yufeng; Chen, Jing 收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03 Thick TSV interposer  high resistivity Si  CPW  Micro-strip  inductor   Process Development of Through-Glass-Via (TGV) Interposer for Radio Frequency (RF) Applications 其他 2016-01-01 Yan, Jun; Ma, Shenglin; Ma, Feilong; Xia, Yanming; Luo, Rongfeng; Jin, Yufeng; Chen, Jing 收藏  |  浏览/下载：7/0  |  提交时间：2017/12/03 TGVinterposer  RF  Electrical property   Corrosion resistance of dicalcium phosphate dihydrate/poly(lactic-co-glycolic acid) hybrid coating on AZ31 magnesium alloy 期刊论文 CORROSION SCIENCE, 2016 Li, Xia; Weng, Zhengyang; Yuan, Wei; Luo, Xianzi; Wong, Hoi Man; Liu, Xiangmei; Wu, Shuilin; Yeung, K. W. K.; Zheng, Yufeng; Chu, Paul K. 收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03 Alloy  Magnesium  EIS  Passive films  IN-VITRO DEGRADATION  CALCIUM-PHOSPHATE  MG ALLOY  BIOMEDICAL APPLICATIONS  SURFACE MODIFICATION  PROTECTIVE-COATINGS  COMPOSITE COATINGS  CA ALLOY  BEHAVIOR  MICROSTRUCTURE   Fabrication and characterization of a tungsten microneedle array based on deep reactive ion etching technology 期刊论文 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2016 Ma, Shenglin; Xia, Yanming; Wang, Yaohua; Ren, Kuili; Luo, Rongfeng; Song, Lu; Chen, Xian; Chen, Jing; Jin, Yufeng 收藏  |  浏览/下载：3/0  |  提交时间：2017/12/04 DELIVERY  ELECTRODE  HYDROGEL  DEVICES   Wafer level Tungsten-Glass Bonding with Photosensitive BCB 其他 2012-01-01 Shan, Yi; Li, Nannan; Zhu, Yunhui; Zhang, Yiming; Chen, Suhui; Luo, Jin; Hu, Jia; Chen, Jing; Jin, Yufeng 收藏  |  浏览/下载：4/0  |  提交时间：2015/11/16