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Influence of Viscoelastic Underfill on Thermal Mechanical Reliability of a 3-D-TSV Stack by Simulation 期刊论文
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2017
Zeng, Qinghua; Guan, Yong; Su, Fei; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Binary Synergistic Sensitivity Strengthening of Bioinspired Hierarchical Architectures based on Fragmentized Reduced Graphene Oxide Sponge and Silver Nanoparticles for Strain Sensors and Beyond 期刊论文
SMALL, 2017
Zhao, Songfang; Guo, Lingzhi; Li, Jinhui; Li, Ning; Zhang, Guoping; Gao, Yongju; Li, Jia; Cao, Duxia; Wang, Wei; Jin, Yufeng; Sun, Rong; Wong, Ching-Ping
收藏  |  浏览/下载：4/0  |  提交时间：2017/12/03
Fabrication and Comparison of Bumpless Wafer-on-Wafer Integration and Bump-Containing Chip-on-Chip Integration 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2017
Guan, Yong; Zhu, Yunhui; Ma, Shenglin; Zeng, Qinghua; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
An Enhancement of Crosstalk Avoidance Code Based on Fibonacci Numeral System for Through Silicon Vias 期刊论文
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2017
Cui, Xiaole; Cui, Xiaoxin; Ni, Yewen; Miao, Min; Jin Yufeng
收藏  |  浏览/下载：7/0  |  提交时间：2017/12/03
Investigations of silicon wafer bonding utilizing sputtered Al and Sn films 期刊论文
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2017
Zhu, Zhiyuan; Yu, Min; Jin, Yufeng
收藏  |  浏览/下载：1/0  |  提交时间：2017/12/03
DEVICES  MEMS  
Recent Advancements in Flexible and Stretchable Electrodes for Electromechanical Sensors: Strategies, Materials, and Features 期刊论文
ACS APPLIED MATERIALS & INTERFACES, 2017
Zhao, Songfang; Li, Jinhui; Cao, Duxia; Zhang, Guoping; Li, Jia; Li, Kui; Yang, Yang; Wang, Wei; Jin, Yufeng; Sun, Rong; Wong, Ching-Ping
收藏  |  浏览/下载：23/0  |  提交时间：2017/12/03
Novel loci and pathways significantly associated with longevity 期刊论文
SCIENTIFIC REPORTS, 2016
Zeng, Yi; Nie, Chao; Min, Junxia; Liu, Xiaomin; Li, Mengmeng; Chen, Huashuai; Xu, Hanshi; Wang, Mingbang; Ni, Ting; Li, Yang; Yan, Han; Zhang, Jin-Pei; Song, Chun; Chi, Li-Qing; Wang, Han-Ming; Dong, Jie; Zheng, Gu-Yan; Lin, Li; Qian, Feng; Qi, Yanwei; Liu, Xiao; Cao, Hongzhi; Wang, Yinghao; Zhang, Lijuan; Li, Zhaochun; Zhou, Yufeng; Wang, Yan; Lu, Jiehua; Li, Jianxin; Qi, Ming; Bolund, Lars; Yashin, Anatoliy; Land, Kenneth C.; Gregory, Simon; Yang, Ze; Gottschalk, William; Tao, Wei; Wang, Jian; Wang, Jun; Xu, Xun; Bae, Harold; Nygaard, Marianne; C
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Fabrication of 1.5mm thickness silicon pin fast neutron detector with guard ring structure 其他
2016-01-01
Zhang, Zhao; Yu, Min; Zhu, Zhiyuan; Wang, Hao; Huang, Yahuan; Jin, Yufeng
收藏  |  浏览/下载：7/0  |  提交时间：2017/12/03
Measurement-based electrical characterization of through silicon vias and transmission lines for 3D integration 期刊论文
MICROELECTRONIC ENGINEERING, 2016
Sun, Xin; Fang, Runiu; Zhu, Yunhui; Zhong, Xiao; Bian, Yuan; Guan, Yong; Miao, Min; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03
A fast and low computation consumption model for system-level thermal management in 3D IC 其他
2016-01-01
Pi, Yudan; Xu, Wenhua; Jin, Yufeng; Wang, Wei; Wang, Ningyu; Zhang, Jiaxi; Luo, Guojie; Miao, Min
收藏  |  浏览/下载：4/0  |  提交时间：2017/12/03

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