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Atomistic study of shock Hugoniot in columnar nanocrystalline copper 期刊论文
COMPUTATIONAL MATERIALS SCIENCE, 2021, 卷号: 197, 页码: 8
作者:  Hu JQ(胡剑桥);  Chen, Zhen
收藏  |  浏览/下载:26/0  |  提交时间:2021/08/30
Adhesion-Free Thin-Film-Like Curvature Sensors Integrated on Flexible and Wearable Electronics for Monitoring Bending of Joints and Various Body Gestures 期刊论文
ADVANCED MATERIALS TECHNOLOGIES, 2019, 卷号: 4, 期号: 2, 页码: AR1800327
作者:  Liu H;  Zhao HY;  Li S(李爽);  Hu JQ(胡剑桥);  Zheng XR
收藏  |  浏览/下载:167/0  |  提交时间:2019/01/09
Systematic study on the mechanical and electric behaviors of the nonbuckling interconnect design of stretchable electronics 期刊论文
SCIENCE CHINA-PHYSICS MECHANICS & ASTRONOMY, 2018, 卷号: 61, 期号: 11, 页码: 114611
作者:  Liu H;  Xue RY;  Hu JQ(胡剑桥);  Ping XC;  Wu HP
收藏  |  浏览/下载:73/0  |  提交时间:2018/10/30
Pressure sensitivity of dislocation density in copper single crystals at submicron scale 期刊论文
MATERIALS RESEARCH EXPRESS, 2018, 卷号: 5, 期号: 1, 页码: 10.1088/2053-1591/aaa0b8
作者:  Hu JQ(胡剑桥);  Chen Z;  Liu ZL;  Zhuang Z
收藏  |  浏览/下载:12/0  |  提交时间:2018/03/05
Strain-Limiting Substrates Based on Nonbuckling, Prestrain-Free Mechanics for Robust Stretchable Electronics 期刊论文
JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME, 2017, 卷号: 84, 期号: 12, 页码: 121010
作者:  Zhang MY;  Liu H;  Cao P;  Chen B;  Hu JQ(胡剑桥)
收藏  |  浏览/下载:43/0  |  提交时间:2017/12/18


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