CORC

浏览/检索结果: 共24条,第1-10条 帮助

限定条件                    
已选(0)清除 条数/页:   排序方式:
Synchrotron radiation imaging study on the rapid IMC growth of Sn-xAg solders with Cu and Ni substrates during the heat preservation stage 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 页码: 589-601
作者:  Guo, Bingfeng;  Kunwar, Anil;  Jiang, Chengrong;  Zhao, Ning;  Sun, Junhao
收藏  |  浏览/下载:4/0  |  提交时间:2019/12/02
Roles of interfacial heat transfer and relative solder height on segregated growth behavior of intermetallic compounds in Sn/Cu joints during furnace cooling 期刊论文
INTERMETALLICS, 2018, 卷号: 93, 页码: 186-196
作者:  Kunwar, Anil;  Guo, Bingfeng;  Shang, Shengyan;  Raback, Peter;  Wang, Yunpeng
收藏  |  浏览/下载:4/0  |  提交时间:2019/12/02
Effect of Ag3Sn nanoparticles and temperature on Cu6Sn5 IMC growth in Sn-xAg/Cu solder joints 期刊论文
MATERIALS RESEARCH BULLETIN, 2018, 卷号: 99, 页码: 239-248
作者:  Guo, Bingfeng;  Kunwar, Anil;  Zhao, Ning;  Chen, Jun;  Wang, Yunpeng
收藏  |  浏览/下载:3/0  |  提交时间:2019/12/02
Formation mechanism and kinetic analysis of the morphology of Cu6Sn5 in the spherical solder joints at the Sn/Cu liquid-solid interface during soldering cooling stage 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2017, 卷号: 28, 页码: 5398-5406
作者:  Guo, Bingfeng;  Ma, Haitao;  Jiang, Chengrong;  Wang, Yunpeng;  Kunwar, Anil
收藏  |  浏览/下载:6/0  |  提交时间:2019/12/02
On the thickness of Cu6Sn5 compound at the anode of Cu/liquid Sn/Cu joints undergoing electromigration 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2016, 卷号: 27, 页码: 7699-7706
作者:  Kunwar, Anil;  Ma, Haoran;  Ma, Haitao;  Guo, Bingfeng;  Meng, Zhixian
收藏  |  浏览/下载:3/0  |  提交时间:2019/12/09
Effect of cooling condition and Ag on the growth of intermetallic compounds in Sn-based solder joints 期刊论文
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2016, 卷号: 122
作者:  Ma, Haoran;  Kunwar, Anil;  Guo, Bingfeng;  Sun, Junhao;  Jiang, Chengrong
收藏  |  浏览/下载:1/0  |  提交时间:2019/12/09
In situ study on the increase of intermetallic compound thickness at anode of molten tin due to electromigration of copper 期刊论文
SCRIPTA MATERIALIA, 2015, 卷号: 107, 页码: 88-91
作者:  Ma, Haitao;  Kunwar, Anil;  Sun, Junhao;  Guo, Bingfeng;  Ma, Haoran
收藏  |  浏览/下载:1/0  |  提交时间:2019/12/09
700℃服役8万小时大量析出σ相AISI321不锈钢的再利用 期刊论文
机械工程材料, 2014, 卷号: 38, 页码: 28-31
作者:  马海涛;  郭林海;  赵艳辉;  高路斯;  赵杰
收藏  |  浏览/下载:1/0  |  提交时间:2019/12/11
700 ℃服役8万h后析出大量sigma相AISI 321不锈钢的再利用 期刊论文
机械工程材料, 2014, 卷号: 38, 页码: 28-31
作者:  马海涛;  郭林海;  赵艳辉;  赵杰;  高路斯
收藏  |  浏览/下载:1/0  |  提交时间:2019/12/11
700℃服役8万h后析出大量σ相AISI 321不锈钢的再利用 期刊论文
机械工程材料, 2014, 页码: 28-31
作者:  马海涛;  郭林海;  赵艳辉;  赵杰;  高路斯
收藏  |  浏览/下载:1/0  |  提交时间:2019/12/11


©版权所有 ©2017 CSpace - Powered by CSpace