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Thermal-Mechanical Reliability Assessment of TSV Structure for 3D IC Integration 其他
2016-01-01
Liu, Huan; Zeng, Qinghua; Guan, Yong; Fang, Runiu; Sun, Xin; Su, Fei; Chen, Jing; Miao, Min; Jin, Yufeng
收藏  |  浏览/下载:5/0  |  提交时间:2017/12/03
Yunnan Province Vegetation Dynamics Using GIMMS NDVI from 1982 similar to 2003 其他
2009-01-01
Miao, Chiyuan; Xiao, Fei; Wang, Yafeng
收藏  |  浏览/下载:3/0  |  提交时间:2015/11/10
Microchannel Water Cooling for LTCC Based Microsystems 其他
2009-01-01
Zhang, Yang-Fei; Chen, Jia-Qi; Bai, Shu-Lin; Jin, Yu-Feng; Miao, Min; Zhang, Jing
收藏  |  浏览/下载:2/0  |  提交时间:2015/11/10
Nanoscale Mechanical Properties and Microstructure of 3D LTCC Substrate 其他
2009-01-01
Zhang, Yang-Fei; Chen, Jia-Qi; Bai, Shu-Lin; Miao, Min; Zhang, Jing; Mu, Fang-Qing; Wang, Zheng-Yi; Xia, Shao-Jun; Jin, Yu-Feng
收藏  |  浏览/下载:5/0  |  提交时间:2015/11/10
MICROSTRUCTURE AND STRENGTH OF LOW TEMPERATURE CO-FIRED CERAMIC SUBSTRATES WITH CHANNELS AND CAVITIES 其他
2008-01-01
Zhang, Yang-Fei; Miao, Min; Jin, Yu-Feng; Bai, Shu-Lin
收藏  |  浏览/下载:3/0  |  提交时间:2015/11/13
The effect of cavities and channels on the strength of LTCC substrate 其他
2007-01-01
Zhang, Yang-Fei; Miao, Min; Bai, Shu-Lin; Jin, Yu-Feng
收藏  |  浏览/下载:5/0  |  提交时间:2015/11/10


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