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Facile way to fabricate high quality white LED with yellow graphene quantum dots 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Zhou, Jipeng[1];  Li, Chunya[2];  Yin, Luqiao[3];  Wang, Liang[4];  Zhang, Jianhua[5]
收藏  |  浏览/下载:5/0  |  提交时间:2019/04/22
Improvement of barrier performance in thin film encapsulation for organic light-emitting diodes by a prior planarization process 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Qin, Cunping[1];  Yang, Jun[2];  Xu, Tao[3];  Ding, Xingwei[4];  Zhang, Jianhua[5]
收藏  |  浏览/下载:10/0  |  提交时间:2019/04/22
The Effect of Glass Frit Paste Levelling Property on Encapsulation 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Tian, Rui[1];  Li, Yi[2];  Wang, Yibin[3];  Yin, Luqiao[4];  Zhang, Jianhua[5]
收藏  |  浏览/下载:6/0  |  提交时间:2019/04/22
High color rendering index and tunable color temperature of white light emitting diodes with yellow emitting graphene quantum dots coated 会议论文
14th China International Forum on Solid State Lighting: International Forum on Wide Bandgap Semiconductors China, SSLChina: IFWS 2017, 2017-11-01
作者:  Zhou, Jipeng[1];  Yin, Luqiao[2];  Zhang, Jianhua[3];  Wang, Liang[4]
收藏  |  浏览/下载:15/0  |  提交时间:2019/04/22
Method to Prevent Thin Film Cracking of Thin Film Encapsulation in Flexible AMOLED 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Ao, Wei[1];  Zhu, Yinghui[2];  Zhang, Jianhua[3];  Xin, Xiaogang[4];  Gao, Feng[5]
收藏  |  浏览/下载:8/0  |  提交时间:2019/04/22
Laser bonding of glass and glass with constant temperature output 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Fu, Xianliang[1];  Tian, Rui[2];  Li, Yi[3];  Yin, Luqiao[4];  Li, Xifeng[5]
收藏  |  浏览/下载:9/0  |  提交时间:2019/04/22
An evaluation method for the restored time-constant function based on the network identification by deconvolution method 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Shu, Wenhao[1];  Zhang, Jianhua[2];  Xu, Xiaoxue[3];  Yang, Lianqiao[4]
收藏  |  浏览/下载:5/0  |  提交时间:2019/04/24
Sintering process of mixed solvent system frit to improve the performance of the film in glass/glass laser bonding 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Li, Yi[1];  Tian, Rui[2];  Yin, Luqiao[3];  Zhang, Jianhua[4]
收藏  |  浏览/下载:4/0  |  提交时间:2019/04/24
Hermeticity Test of Low-Melting Point Sealing Glass and Analysis of Encapsulation Failure 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Tian, Rui[1];  Li, Yi[2];  Yin, Luqiao[3];  Zhang, Jianhua[4]
收藏  |  浏览/下载:11/0  |  提交时间:2019/04/24
Reduction of Eddy-Current Loss in Flux-Switching Permanent-Magnet Machines Using Rotor Magnetic Flux Barriers 会议论文
IEEE International Magnetics Conference (Intermag), 2017-11-01
作者:  Luo, Jianhua[1];  Zhao, Wenxiang[2];  Ji, Jinghua[3];  Zheng, Junqiang[4];  Zhang, Ying[5]
收藏  |  浏览/下载:9/0  |  提交时间:2019/12/24


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