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Improved Reliability of Electrically Conductive Adhesives Joints on Cu-Plated PCB Substrate Enhanced by Graphene Protection Barrier 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Huang, Shirong[1];  Ke, Wei[2];  Yang, Yiqun[3];  Ye, Hui[4];  Chen, Shujing[5]
收藏  |  浏览/下载:41/0  |  提交时间:2019/04/24
Graphene-based Heat Spreading Materials for Electronics Packaging Applications 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Yuan, Guangjie[1];  Shan, Bo[2];  Chen, Shujing[3];  Yang, Yiqun[4];  Bao, Jie[5]
收藏  |  浏览/下载:6/0  |  提交时间:2019/04/24
Direct inkjet printing of miniaturized luminescent YAG:Er3+ from sol-gel precursor 会议论文
6th International Workshop on Photoluminescence in Rare Earths (PRE) - Photonic Materials and Devices, 2017-06-01
作者:  Hong, Yuzhe[1];  Chen, Zhaoxi[2];  Trofimov, Artem A.[3];  Lei, Jincheng[4];  Chen, Jie[5]
收藏  |  浏览/下载:3/0  |  提交时间:2019/12/24
Influence of Gamma-ray irradiation on the spectral properties of Bi-doped silica fibers 会议论文
Asia Communications and Photonics Conference, ACP 2014, 2014-11-11
作者:  Wang, Jie[1];  Wen, Jianxiang[2];  Dong, Yanhua[3];  Liu, Lin[4];  Pang, Fufei[5]
收藏  |  浏览/下载:3/0  |  提交时间:2019/04/30
Pharmacology research progress of paeonol 会议论文
8th International Conference on Molecular Imprinting, MIP 2014, 2014-09-18
作者:  Guo, Qi[1];  Zhao, Chuanxiang[2];  Zhang, Shiqing[3];  Ju, Zhao[4];  Chen, Fang[5]
收藏  |  浏览/下载:5/0  |  提交时间:2019/12/24
Synthesis and properties of a novel Si-Ti polymer/montmorillonite nanocomposites 会议论文
8th International Conference on Molecular Imprinting, MIP 2014, 2014-09-18
作者:  Yuan, Xinhua[1];  Han, Liyin[2];  Su, Qiu[3];  Guo, Wenhua[4];  Xu, Hongxing[5]
收藏  |  浏览/下载:4/0  |  提交时间:2019/12/24
Friction properties of PTFE Matrix composites reinforced by PPS and PPTA fibers 会议论文
8th International Conference on Molecular Imprinting, MIP 2014, 2014-09-18
作者:  Yuan, Xinhua[1];  Yang, Jing[2];  Chen, Yanqiu[3];  Zhu, Enbo[4];  Xu, Hongxing[5]
收藏  |  浏览/下载:12/0  |  提交时间:2019/12/24
HKMG all Last to Meet 20nm Logic Device Challenge 会议论文
China Semiconductor Technology International Conference (CSTIC), 2013-03-19
作者:  Xie, Xinyun[1];  Ju, Jianhua[2];  Yu, Shaofeng[3];  Fu, Fenghua[4];  Zhao, Jie[5]
收藏  |  浏览/下载:11/0  |  提交时间:2019/04/30
A fully integrated, highly linear SiGe BiCMOS class-AB power amplifier targeting 2.4GHz applications 会议论文
2nd Asia Pacific Conference on Postgraduate Research in Microelectronics and Electronics, PrimeAsia 2010, 2010-09-22
作者:  Zhang, Shulin[1];  Su, Jie[2];  Chen, Lei[3];  Tian, Liang[4];  Zhou, Jin[5]
收藏  |  浏览/下载:3/0  |  提交时间:2019/04/30


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