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浏览/检索结果: 共13条，第1-10条 帮助 限定条件 内容类型：会议论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Development of High Power Annular Diode Laser Array Using Hard Solder 会议论文 San Francisco, CA, 2019-02-04 作者:  Hou, Dong;  Sun, Lichen;  Fu, Tuanwei;  Chen, Li;  Liang, Xuejie 收藏  |  浏览/下载：53/0  |  提交时间：2019/06/28 Diode Laser Stack  Hard Solder  High Power  Stress  Annular   Structural Protein of Various AAV Serotypes is Involved in the Transcription of Viral Genome 会议论文 作者:  Yu, Chenghui;  Ran, Gai;  Chen, Jingwei;  Hou, Jian;  Ling, Chen 收藏  |  浏览/下载：1/0  |  提交时间：2019/12/05 High power multiple wavelength diode laser stack for DPSSL application without temperature control 会议论文 San Francisco, CA, United states, 2018-01-30 作者:  Hou, Dong;  Yin, Xia;  Wang, Jingwei;  Chen, Shi;  Zhan, Yun 收藏  |  浏览/下载：60/0  |  提交时间：2018/04/25 High Power Diode Laser Array Development using Completely Indium Free Packaging Technology with Narrow Spectrum 会议论文 conference on components and packaging for laser systems ii, san francisco, ca, 2016-02-16 作者:  Hou, Dong;  Wang, Jingwei;  Gao, Lijun;  Liang, Xuejie;  Li, Xiaoning 收藏  |  浏览/下载：15/0  |  提交时间：2016/10/18 Horizontal array  Hard Solder  Spetrum Control   Packaging of Hard Solder 500W QCW Diode Laser Array 会议论文 conference on components and packaging for laser systems ii, san francisco, ca, 2016-02-16 作者:  Li, Xiaoning;  Wang, Jingwei;  Hou, Dong;  Nie, Zhiqiang;  Liu, Xingsheng 收藏  |  浏览/下载：11/0  |  提交时间：2016/10/18 diode laser  MCC  hard solder  high power   Advances in Bonding Technology for High Power Diode Laser Bars 会议论文 作者:  Wang, Jingwei;  Li, Xiaoning;  Hou, Dong;  Feng, Feifei;  Liu, Yalong 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/02 indium-free packaging  bonding  reliability  lifetime  hard pulse  Laser bar   Packaging of Complete Indium-free High Reliable and High Power Diode Laser Array 会议论文 作者:  Wang, Jingwei;  Li, Xiaoning;  Feng, Feifei;  Liu, Yalong;  Hou, Dong 收藏  |  浏览/下载：1/0  |  提交时间：2019/12/02 conduction cooled  hard solder  indium-free  packaging process  reliability  AuSn  hard pulse  Diode laser   Effect of Interface Layer on the Performance of High Power Diode Laser Arrays 会议论文 作者:  Zhang, Pu;  Wang, Jingwei;  Xiong, Lingling;  Li, Xiaoning;  Hou, Dong 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02 Packaging  Interface layer  Voids  Spectrum  Diode laser array   High Power Diode Laser Stack Development Using Gold-Tin Bonding Technology 会议论文 conference on components and packaging for laser systems, san francisco, ca, 2015-02-09 作者:  Hou, Dong;  Wang, Jingwei;  Zhang, Pu;  Cai, Lei;  Dai, Ye 收藏  |  浏览/下载：17/0  |  提交时间：2015/12/04 Packaging of Complete Indium-free High Reliable and High Power Diode Laser Array 会议论文 20th international symposium on high power laser systems and applications (hpls and a), chengdu, peoples r china, 2014-08-25 作者:  Wang, Jingwei;  Li, Xiaoning;  Feng, Feifei;  Liu, Yalong;  Hou, Dong 收藏  |  浏览/下载：21/0  |  提交时间：2015/12/04