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Solder Joint Degradation Analysis Using Time Domain Reflectometry (CPCI-S收录) 会议论文
2011 INTERNATIONAL CONFERENCE ON QUALITY, RELIABILITY, RISK, MAINTENANCE, AND SAFETY ENGINEERING (ICQR2MSE)
作者:  Wan, Ming[1,2];  Lu, Yudong[2];  Yao, Bin[2];  Feng, Jingdong[2];  En, Yunfei[2]
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