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Detecting sediment concentration using contact image sensor 会议论文
9th International Conference on Scour and Erosion, ICSE 2018, Taipei, Taiwan, 2018-11-05
作者:  Yao, W.;  An, H.;  Draper, S.;  Cheng, L.;  Zhao, M.
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/02
A Selective Ensemble Learning Framework for ECG-Based Heartbeat Classification with Imbalanced Data 会议论文
Proceedings - 2018 IEEE International Conference on Bioinformatics and Biomedicine, BIBM 2018
作者:  Ge, H.;  Sun, K.;  Sun, L.;  Zhao, M.;  Wu, C.
收藏  |  浏览/下载：25/0  |  提交时间：2019/12/02
The VHCF experimental investigation of FV520B-I with surface roughness Ry 会议论文
INTERNATIONAL CONFERENCE ON COMPUTER INFORMATION AND AUTOMATION ENGINEERING, 2018-01-01
作者:  Wang, J. L.;  Zhang, Y. L.;  Ding, M. C.;  Zhao, Q. C.
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/02
Research on Fabrication of a Multi-Scale Inertial Switch with Ultra-High Aspect Ratio 会议论文
MICRO-NANO TECHNOLOGY XVII-XVIII, 2018-01-01
作者:  Du, L. Q.;  Chen, S. L.;  Zhao, M.;  Tao, Y. S.;  Luo, L.
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/02
Online Data Segmentation Based on Clustering Algorithm and Autoregressive Model for Human Actions Recognition 会议论文
2017 4TH INTERNATIONAL CONFERENCE ON INFORMATION, CYBERNETICS AND COMPUTATIONAL SOCIAL SYSTEMS (ICCSS), 2017-01-01
作者:  Jiang, M.;  Liu, X. L.;  Zhang, Z.;  Zhao, Y.;  Zhang, R.
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/03
Low temperature Ni/Sn/Ni transient liquid phase bonding for high temperature packaging applications by imposing temperature gradient 会议论文
2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), 2017-01-01
作者:  Zhong, Y.;  Zhao, N.;  Ma, H. T.;  Dong, W.;  Huang, M. L.
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/09
Vortex Formation in the Wake of a Streamwisely Oscillating Cylinder in Steady Flow 会议论文
3rd Symposium on Fluid-Structure-Sound Interactions and Control (FSSIC), Perth, AUSTRALIA, 2016-01-01
作者:  Tang, G.;  Cheng, L.;  Lu, L.;  Zhao, M.;  Tong, F.
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/09
Novel growth of whole preferred orientation intermetallic compound interconnects for 3D IC packaging 会议论文
66th IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, NV, 2016-05-31
作者:  Huang, M. L.;  Zhang, Z. J.;  Yang, F.;  Zhao, N.
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09
Cross-solder interaction on interfacial reactions in Ni/Sn-3.0Ag-0.5Cu/Cu solder interconnects 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16
作者:  Fan, M.;  Huang, M. L.;  Zhao, N.
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/09
Microstructure and interfacial reactions of Sn-Au-Ag solder joints on Cu and Ni substrates 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16
作者:  Chen, Y.;  Huang, M. L.;  Zhao, N.
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09

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