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科研机构
大连理工大学 [50]
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会议论文 [50]
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2018 [11]
2017 [8]
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内容类型:会议论文
专题:大连理工大学
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Stability of Multilayered Ag/Ag3Sn/Sn Films Noncyanide Electroplateded for high-reflective back-electrode
会议论文
19th International Conference on Electronic Packaging Technology, ICEPT 2018, Shanghai, China, 2018-08-08
作者:
Ji, Shengnan
;
Ma, Haitao
;
Wang, Chen
;
Zhao, Ning
;
Wang, Yunpeng
收藏
  |  
浏览/下载:10/0
  |  
提交时间:2019/12/02
Indirect economic impact assessment of sea ice disasters on industries related in China
会议论文
28th International Ocean and Polar Engineering Conference, 2018, Sapporo, Japan, 2018-06-10
作者:
Liu, Xueqin
;
Yuan, Shuai
;
Wu, Jidong
;
Song, Lina
;
Ma, Yuxian
收藏
  |  
浏览/下载:10/0
  |  
提交时间:2019/12/02
Growth mechanism of Cu3Sn grains in the (111) Cu/Sn/Cu micro interconnects
会议论文
19th International Conference on Electronic Packaging Technology, ICEPT 2018, Shanghai, China, 2018-08-08
作者:
Zhong, Yi
;
Zhao, Ning
;
Dong, Wei
;
Wang, Yunpeng
;
Ma, Haitao
收藏
  |  
浏览/下载:7/0
  |  
提交时间:2019/12/02
Process development and reliability for wafer-level 3D IC integration using micro-bump/adhesive hybrid bonding and via-last TSVs
会议论文
19th International Conference on Electronic Packaging Technology, ICEPT 2018, Shanghai, China, 2018-08-08
作者:
Yao, Mingjun
;
Zhao, Ning
;
Yu, Daquan
;
Xiao, Zhiyi
;
Ma, Haitao
收藏
  |  
浏览/下载:14/0
  |  
提交时间:2019/12/02
Process development and reliability for wafer-level 3D IC integration using micro- bump/adhesive hybrid bonding and via-last TSVs
会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:
Yao, Mingjun
;
Zhao, Ning
;
Yu, Daquan
;
Xiao, Zhiyi
;
Ma, Haitao
收藏
  |  
浏览/下载:10/0
  |  
提交时间:2019/12/02
3D IC
wafer-level hybrid bonding
insert Cu pillar solder bump
dry film adhesive
TSVs
reliability
Stability of Multilayered Ag/Ag3Sn/Sn Films Non-cyanide Electroplateded for high-reflective back-electrode
会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:
Ji, Shengnan
;
Wang, Chen
;
Wang, Yunpeng
;
Ma, Haitao
;
Zhao, Ning
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/12/02
electrodeposition
reflectivity
sulfidation resistance
Ag/Ag3Sn/Sn layers
Growth mechanism of Cu3Sn grains in the (111)Cu/Sn/Cu micro interconnects
会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:
Zhong, Yi
;
Zhao, Ning
;
Dong, Wei
;
Wang, Yunpeng
;
Ma, Haitao
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/12/02
electronic packaging
soldering
intermetallic compound
grain orientation
temperature gradient
anisotropy
Effect of Temperature Gradient on Interfacial Reactions in Cu/Sn-9Zn/Ni Solder Joints during Aging
会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:
Zhao, Ning
;
Wang, Mingyao
;
Zhong, Yi
;
Ma, Haitao
;
Wang, Yunpeng
收藏
  |  
浏览/下载:19/0
  |  
提交时间:2019/12/02
Sn-9Zn solder
Interfacial reaction
Aging
Temperature gradient
Intermetallic Compound
Growth Behavior of Cu6Sn5 Grains at Sn/(001)Cu Interface by Imposing Temperature Gradient
会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:
Zhao, Ning
;
Chen, Shi
;
Liu, Chunying
;
Zhong, Yi
;
Ma, Haitao
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/12/02
3D packaging
Cu6Sn5
regular grains
anisotropy
temperature gradient
ADAPTIVE PRE-COMPENSATION OF THE CONTOURING ERROR FOR HIGH-PRECISION PARAMETRIC CURVED CONTOUR FOLLOWING
会议论文
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2017, VOL 4B, 2018-01-01
作者:
Ma, Jian-Wei
;
Song, De-Ning
;
Jia, Zhen-Yuan
;
Zhang, Ning
;
Hu, Guo-Qing
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/12/02
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