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浏览/检索结果: 共23条，第1-10条 帮助 限定条件 发表日期：2020    内容类型：期刊论文    专题：金属研究所    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Enhancement of spin-orbit torque and modulation of Dzyaloshinskii-Moriya interaction in Pt100-xCrx/Co/AlOx trilayer 期刊论文 APPLIED PHYSICS LETTERS, 2020, 卷号: 117, 期号: 22, 页码: 5 作者:  Quan, Jiazhi;  Zhao, Xiaotian;  Liu, Wei;  Liu, Long;  Song, Yuhang 收藏  |  浏览/下载：46/0  |  提交时间：2021/02/02 Enhancement of spin-orbit torque and modulation of Dzyaloshinskii-Moriya interaction in Pt100-xCrx/Co/AlOx trilayer 期刊论文 APPLIED PHYSICS LETTERS, 2020, 卷号: 117, 期号: 22, 页码: 5 作者:  Quan, Jiazhi;  Zhao, Xiaotian;  Liu, Wei;  Liu, Long;  Song, Yuhang 收藏  |  浏览/下载：34/0  |  提交时间：2021/02/02 The interfacial reaction and microstructure of Co/In/Cu sputtering target assembly after soldering 期刊论文 MICROELECTRONICS RELIABILITY, 2020, 卷号: 113, 页码: 6 作者:  Liu, Zhi-Quan;  Meng, Zhi-Chao;  Wu, Di;  Shang, Zhengang;  He, Xin 收藏  |  浏览/下载：70/0  |  提交时间：2021/02/02 Co sputtering target  Soldering assembly  Interface  IMC  Growth mechanism   The effect of finish layer on the interfacial cracking failure of Au-Si bonding 期刊论文 ENGINEERING FAILURE ANALYSIS, 2020, 卷号: 115, 页码: 8 作者:  Gao, Li-Yin;  Wen, Jian;  Li, Cai-Fu;  Chen, Chunhuan;  Liu, Zhi-Quan 收藏  |  浏览/下载：15/0  |  提交时间：2021/02/02 AuSi bonding  NiCo  Intermetallic compounds (IMCs)  Failure analysis  Crack   Focused ion beam preparation of microbeams forin situmechanical analysis of electroplated nanotwinned copper with probe type indenters 期刊论文 JOURNAL OF MICROSCOPY, 2020, 卷号: 279, 期号: 3, 页码: 212-216 作者:  Robertson, Stuart;  Doak, Scott;  Sun, Fu-Long;  Liu, Zhi-Quan;  Liu, Changqing 收藏  |  浏览/下载：29/0  |  提交时间：2021/02/02 Chunk lift-out  focused ion beam  in situ  micromechanical testing  nanotwinned copper  P-FIB   Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9 作者:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan 收藏  |  浏览/下载：46/0  |  提交时间：2021/02/02 Mixed soldering  ball grid array  solidification  crack  shrinkage  failure mechanism   Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9 作者:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan 收藏  |  浏览/下载：42/0  |  提交时间：2021/02/02 Mixed soldering  ball grid array  solidification  crack  shrinkage  failure mechanism   Unravelling the role of active-site isolation in reactivity and reaction pathway control for acetylene hydrogenation 期刊论文 CHEMICAL COMMUNICATIONS, 2020, 卷号: 56, 期号: 47, 页码: 6372-6375 作者:  Liu, Siyang;  Niu, Yiming;  Wang, Yongzhao;  Chen, Junnan;  Quan, Xueping 收藏  |  浏览/下载：34/0  |  提交时间：2021/02/02 Unravelling the role of active-site isolation in reactivity and reaction pathway control for acetylene hydrogenation 期刊论文 CHEMICAL COMMUNICATIONS, 2020, 卷号: 56, 期号: 47, 页码: 6372-6375 作者:  Liu, Siyang;  Niu, Yiming;  Wang, Yongzhao;  Chen, Junnan;  Quan, Xueping 收藏  |  浏览/下载：25/0  |  提交时间：2021/02/02 Mechanical properties and thermal stability of 7055 Al alloy by minor Sc addition 期刊论文 RARE METALS, 2020, 卷号: 39, 期号: 6, 页码: 725-732 作者:  Liu, Chong-Yu;  Teng, Guang-Biao;  Ma, Zong-Yi;  Wei, Li-Li;  Zhou, Wen-Biao 收藏  |  浏览/下载：23/0  |  提交时间：2021/02/02 Al alloy  Sc addition  Microstructure  Mechanical properties