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浏览/检索结果: 共49条，第1-10条 帮助 限定条件 发表日期：2018    专题：大连理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Stability of Multilayered Ag/Ag3Sn/Sn Films Noncyanide Electroplateded for high-reflective back-electrode 会议论文 19th International Conference on Electronic Packaging Technology, ICEPT 2018, Shanghai, China, 2018-08-08 作者:  Ji, Shengnan;  Ma, Haitao;  Wang, Chen;  Zhao, Ning;  Wang, Yunpeng 收藏  |  浏览/下载：10/0  |  提交时间：2019/12/02 Indirect economic impact assessment of sea ice disasters on industries related in China 会议论文 28th International Ocean and Polar Engineering Conference, 2018, Sapporo, Japan, 2018-06-10 作者:  Liu, Xueqin;  Yuan, Shuai;  Wu, Jidong;  Song, Lina;  Ma, Yuxian 收藏  |  浏览/下载：10/0  |  提交时间：2019/12/02 Growth mechanism of Cu3Sn grains in the (111) Cu/Sn/Cu micro interconnects 会议论文 19th International Conference on Electronic Packaging Technology, ICEPT 2018, Shanghai, China, 2018-08-08 作者:  Zhong, Yi;  Zhao, Ning;  Dong, Wei;  Wang, Yunpeng;  Ma, Haitao 收藏  |  浏览/下载：7/0  |  提交时间：2019/12/02 Deformation analysing for thin-walled parts based on analysis of single-tooth or multi-tooth milling 期刊论文 International Journal of Machining and Machinability of Materials, 2018, 卷号: 20, 页码: 575-593 作者:  Ma, Jian-Wei;  Zhang, Ning;  Chen, Si-Yu;  Su, Wei-Wei;  Hu, Guo-Qing 收藏  |  浏览/下载：1/0  |  提交时间：2019/12/02 Process development and reliability for wafer-level 3D IC integration using micro-bump/adhesive hybrid bonding and via-last TSVs 会议论文 19th International Conference on Electronic Packaging Technology, ICEPT 2018, Shanghai, China, 2018-08-08 作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao 收藏  |  浏览/下载：14/0  |  提交时间：2019/12/02 Experimental Study on the Performance of a Crashworthy Device for the Monopile Offshore Wind Turbine against Ship Impact 期刊论文 ENERGIES, 2018, 卷号: 11 作者:  Ren, Nianxin;  Li, Wei;  Ma, Zhe;  Ou, Jinping;  Ning, Dezhi 收藏  |  浏览/下载：9/0  |  提交时间：2019/12/02 crashworthy device  monopile foundation  offshore wind turbine  ship impact  model tests   High-precision estimation and double-loop compensation of contouring errors in five-axis dual-NURBS toolpath following tasks 期刊论文 PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY, 2018, 卷号: 54, 页码: 243-253 作者:  Jia, Zhen-yuan;  Song, De-ning;  Ma, Jian-wei;  Qin, Feng-ze;  Wang, Xu-lin 收藏  |  浏览/下载：11/0  |  提交时间：2019/12/02 Five axis contouring error  Contouring-error estimation  Dual-NURBS toolpath  Double-loop compensation   A highly selective fluorescent probe for detecting glutathione transferases to reveal anticancer-activity sensitivity of cisplatin in cancer cells and tumor tissues 期刊论文 SENSORS AND ACTUATORS B-CHEMICAL, 2018, 卷号: 277, 页码: 423-430 作者:  Tian, Xiangge;  Tian, Zhenhao;  Wang, Yan;  Hou, Jie;  Feng, Lei 收藏  |  浏览/下载：11/0  |  提交时间：2019/12/02 Glutathione transferases  Fluorescent probe  Cellular imaging  Cisplatin resistance   Process development and reliability for wafer-level 3D IC integration using micro- bump/adhesive hybrid bonding and via-last TSVs 会议论文 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01 作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao 收藏  |  浏览/下载：10/0  |  提交时间：2019/12/02 3D IC  wafer-level hybrid bonding  insert Cu pillar solder bump  dry film adhesive  TSVs  reliability   Stability of Multilayered Ag/Ag3Sn/Sn Films Non-cyanide Electroplateded for high-reflective back-electrode 会议论文 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01 作者:  Ji, Shengnan;  Wang, Chen;  Wang, Yunpeng;  Ma, Haitao;  Zhao, Ning 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/02 electrodeposition  reflectivity  sulfidation resistance  Ag/Ag3Sn/Sn layers