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浏览/检索结果: 共9条，第1-9条 帮助 限定条件 发表日期：2017     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Numerical Modeling and Dynamic Characteristics of Thermal and Mass Transport in Solder joints during Laser soldering 项目 2017- 作者:  ANIL KUNWAR 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02 激光钎焊互连焊点热及物质传输动态特征及数值模拟研究 项目 2017- 作者:  ANIL KUNWAR 收藏  |  浏览/下载：1/0  |  提交时间：2019/12/03 Formation mechanism and kinetic analysis of the morphology of Cu6Sn5 in the spherical solder joints at the Sn/Cu liquid-solid interface during soldering cooling stage 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2017, 卷号: 28, 页码: 5398-5406 作者:  Guo, Bingfeng;  Ma, Haitao;  Jiang, Chengrong;  Wang, Yunpeng;  Kunwar, Anil 收藏  |  浏览/下载：6/0  |  提交时间：2019/12/02 In situ study the effects of Cu addition on the rapidly growth of Cu6Sn5 at the Sn-base solder/Cu L-S interface during soldering heat preservation stage 会议论文 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01 作者:  Guo, Bingfeng;  Jiang, Chengrong;  Kunwar, Anil;  Chen, Jun;  Zhao, Ning 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03 Synchrotron radiation  heat preservation stage  microstructure  Cu addition  mechanism   Effect of Ag concentration on the Cu6Sn5 growth in Sn-based solder/Cu joints at the isothermal reflow stage 会议论文 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01 作者:  Guo, Bingfeng;  Jiang, Chengrong;  Kunwar, Anil;  Zhao, Ning;  Chen, Jun 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03 high pressure air  synchrotron radiation  microstructure  Ag concentration  growth activity energy  mechanism   Effects of Cu Nanoparticles Doped Flux on the Microstructure of IMCs between Sn Solder and Cu Substrate 会议论文 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01 作者:  Shang, Shengyan;  Kunwar, Anil;  Wu, Yingchao;  Ma, Haitao 收藏  |  浏览/下载：7/0  |  提交时间：2019/12/03 Cu nanoparticles  flux  IMCs  growth behavior   Quantitative Polynomial Free Energy based Phase Field Model for Void Motion and Evolution in Sn under Thermal Gradient 会议论文 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01 作者:  Kunwar, Anil;  Tonks, Michael R.;  Shang, Shengyan;  Song, Xueguan;  Wang, Yunpeng 收藏  |  浏览/下载：6/0  |  提交时间：2019/12/03 Reliability  Phase field method  Quantitative polynomial free energy  Void  Pb-free solder   Geometrical outline evolution and size-inhibiting interaction of interfacial solder bubbles and IMCs during multiple reflows 期刊论文 VACUUM, 2017, 卷号: 145, 页码: 103-111 作者:  Ma, Haoran;  Wang, Yunpeng;  Chen, Jun;  Kunwar, Anil;  Ma, Haitao 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09 Solder bubble  Interface  IMC  In situ  Synchrotron radiation   Size effect on IMC growth induced by Cu concentration gradient and pinning of Ag3Sn particles during multiple reflows 期刊论文 INTERMETALLICS, 2017, 卷号: 90, 页码: 90-96 作者:  Ma, Haoran;  Kunwar, Anil;  Huang, Ru;  Chen, Jun;  Wang, Yunpeng 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/09 Intermetallics  Diffusion  Crystal growth Joining  Interfaces Grain boundary