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浏览/检索结果: 共4条，第1-4条 帮助 限定条件 发表日期：2015     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 In situ aging study on the variation of Sn0. 7Cu/Cu solid interface marked by bubbles 会议论文 16 int conf elect packaging technology, Chinese Inst Elect,China IEEE Component Packaging, & Mfg Tech Soci IEEE-C, Changsha, PEOPLES R CHINA 作者:  Ma, Haoran;  Kunwar, Anil;  Sun, Junhao;  Zhao, Ning;  Huang, Mingliang 收藏  |  浏览/下载：1/0  |  提交时间：2019/12/09 bubbles  in situ aging  solid interface  motion  intermetallic compounds  growth orientation  diffusion  SEM   Modeling the Diffusion-Driven Growth of a Pre-Existing Gas Bubble in Molten Tin 期刊论文 METALS AND MATERIALS INTERNATIONAL, 2015, 卷号: 21, 页码: 962-970 作者:  Kunwar, Anil;  Ma, Haitao;  Sun, Junhao;  Li, Shuang;  Liu, Jiahui 收藏  |  浏览/下载：11/0  |  提交时间：2019/12/09 bubble  metals  soldering  diffusion  synchrotron radiation   Effects of Soldering Temperature and Cooling Rate on the as-Soldered Microstructures of Intermetallic Compounds in Sn-0.7Cu/Cu Joint 会议论文 16 int conf elect packaging technology, Chinese Inst Elect,China IEEE Component Packaging, & Mfg Tech Soci IEEE-C, Changsha, PEOPLES R CHINA, 2015-08-11 作者:  Guo, Bingfeng;  Kunwar, Anil;  Ma, Haoran;  Liu, Jiahui;  Li, Shuang 收藏  |  浏览/下载：6/0  |  提交时间：2019/12/09 IMC  morphology  cooling  temperature  synchrotron radiation   In situ study on the increase of intermetallic compound thickness at anode of molten tin due to electromigration of copper 期刊论文 SCRIPTA MATERIALIA, 2015, 卷号: 107, 页码: 88-91 作者:  Ma, Haitao;  Kunwar, Anil;  Sun, Junhao;  Guo, Bingfeng;  Ma, Haoran 收藏  |  浏览/下载：1/0  |  提交时间：2019/12/09 Electromigration  Synchrotron radiation  Inter-metallic compound  Finite volume method  Level-set variable