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Growth behavior of Cu6Sn5 in Sn-6.5 Cu solders under DC considering trace Al: In situ observation 期刊论文
INTERMETALLICS, 2015, 卷号: 58, 页码: 84-90
作者:  Wang, Tongmin;  Zhou, Peng;  Cao, Fei;  Kang, Huijun;  Chen, Zongning
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