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The effects of third alloying elements on the bulk Ag(3)Sn formation in slowly cooled Sn-3.5Ag lead-free solder 期刊论文
2008, 卷号: 19, 页码: 275-280
作者:  Shen, Jun[1];  Lai, Shiqiang[1];  Liu, Yongchang[2];  Gao, Houxiu[2];  Wei, Jun[3]
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